公开(公告)号：US20170179098A1

公开(公告)日：2017-06-22

申请号：US15355476

申请日：2016-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyein YOO ,  Yeongseok KIM

IPC: H01L25/00 ,  H01L23/31 ,  H01L21/78 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/552 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.

公开(公告)号：US20220246491A1

公开(公告)日：2022-08-04

申请号：US17726916

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  C09J7/28 ,  C09J11/04

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20200211920A1

公开(公告)日：2020-07-02

申请号：US16540495

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20180158810A1

公开(公告)日：2018-06-07

申请号：US15889957

申请日：2018-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyein YOO ,  Yeongseok KIM

IPC: H01L25/00 ,  H01L21/78 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/552 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.

公开(公告)号：US20170358467A1

公开(公告)日：2017-12-14

申请号：US15470606

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Gi CHANG ,  YEONGSEOK KIM ,  Hyein YOO

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67121 ,  H01L21/568 ,  H01L21/673 ,  H01L23/3128 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3511

Abstract: The present disclosure relates to a method of fabricating a semiconductor package. The method may include forming a cavity in a package substrate and providing the package substrate and a die on a carrier tape film. Here, the carrier tape film may include a tape substrate and an insulating layer on the tape substrate, and the die may be provided in the cavity of the package substrate. The method may further include subsequently forming an encapsulation layer to cover the insulating layer and the die in the cavity and cover the package substrate on the insulating layer and removing the tape substrate from the insulating layer.