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公开(公告)号:US10224343B2
公开(公告)日:2019-03-05
申请号:US15869599
申请日:2018-01-12
发明人: Bo Soon Kim , Hyun Ji Kim , Jeong Yun Lee , Gi Gwan Park , Sang Duk Park , Young Mook Oh , Yong Seok Lee
IPC分类号: H01L27/088 , H01L27/12 , H01L29/06 , H01L29/423 , H01L21/84 , H01L29/66 , H01L29/49 , H01L29/51 , H01L21/8234 , H01L29/78
摘要: There is provided a semiconductor device capable of enhancing device performance by variably adjusting threshold voltage of a transistor having gate-all-around structure. The semiconductor device includes a substrate including a first region and a second region, a first wire pattern provided on the first region of the substrate and spaced apart from the substrate, a second wire pattern provided on the second region of the substrate and spaced apart from the substrate, a first gate insulating film surrounding a perimeter of the first wire pattern, a second gate insulating film surrounding a perimeter of the second wire pattern, a first gate electrode provided on the first gate insulating film, intersecting with the first wire pattern, and including a first metal oxide film therein, a second gate electrode provided on the second gate insulating film and intersecting with the second wire pattern, a first gate spacer on a sidewall of the first gate electrode, and a second gate spacer on a sidewall of the second gate electrode.
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公开(公告)号:US09899416B2
公开(公告)日:2018-02-20
申请号:US15403307
申请日:2017-01-11
发明人: Bo Soon Kim , Hyun Ji Kim , Jeong Yun Lee , Gi Gwan Park , Sang Duk Park , Young Mook Oh , Yong Seok Lee
IPC分类号: H01L27/088 , H01L27/12 , H01L29/06 , H01L29/423 , H01L21/84 , H01L29/49 , H01L29/51 , H01L21/8234 , H01L29/78
CPC分类号: H01L27/1203 , H01L21/823456 , H01L21/823462 , H01L21/823468 , H01L21/84 , H01L21/845 , H01L27/1211 , H01L29/0653 , H01L29/0673 , H01L29/42392 , H01L29/4908 , H01L29/4966 , H01L29/4991 , H01L29/517 , H01L29/66439 , H01L29/7853
摘要: There is provided a semiconductor device capable of enhancing device performance by variably adjusting threshold voltage of a transistor having gate-all-around structure. The semiconductor device includes a substrate including a first region and a second region, a first wire pattern provided on the first region of the substrate and spaced apart from the substrate, a second wire pattern provided on the second region of the substrate and spaced apart from the substrate, a first gate insulating film surrounding a perimeter of the first wire pattern, a second gate insulating film surrounding a perimeter of the second wire pattern, a first gate electrode provided on the first gate insulating film, intersecting with the first wire pattern, and including a first metal oxide film therein, a second gate electrode provided on the second gate insulating film and intersecting with the second wire pattern, a first gate spacer on a sidewall of the first gate electrode, and a second gate spacer on a sidewall of the second gate electrode.
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