Abstract:
A power transmitting apparatus includes a driving source, a driving member rotated by the driving source, a driven member linked with the driving member to rotate, a transmitting member disposed between the driving member and the driven member, the transmitting member being rotated by the driving member, axially moved along a rotation direction of the driving member so that the transmitting member is connected to the driven member, and an elastic member disposed between the transmitting member and the driven member, the elastic member providing an elastic bias into the transmitting member so that the transmitting member is separated from the driven member.
Abstract:
A memory module includes a first rank, a second rank and a test control unit. The first rank includes a plurality of semiconductor memory devices configured to operate in response to a first chip selection signal. The second rank includes a plurality of semiconductor memory devices configured to operate in response to a second chip selection signal. The test control unit is configured to simultaneously enable the first and second chip selection signals to test the first and second ranks in a test mode.
Abstract:
A paper feeding apparatus includes a transfer roller that provides a transfer force of a first direction onto the upper surface of a recording medium; a retard roller that faces the transfer roller to form a transfer nip and provides a transfer force of a second direction opposite to the first direction onto the lower surface of the recording medium; a driving unit that drives the retard roller; and a power delivery unit that connects the driving unit to the retard roller by using a magnetic force and provides a magnetic driving force that is smaller than the transfer force provided by the transfer roller when one recording medium exists in the transfer nip and is larger than a frictional force between two or more recording media when the two or more recording media exist in the transfer nip.
Abstract:
A semiconductor device includes a substrate including a first region and a second region, an active gate structure on the substrate in the first region, a dummy gate structure on the substrate in the second region, a source/drain on the substrate in the first region at each of opposite sides of the active gate structure, a plurality of first conductive contacts respectively connected to the active gate structure and the source/drain, a resistive structure on the dummy gate structure in the second region, a plurality of second conductive contacts respectively connected to the plurality of first conductive contacts and the resistive structure, and an etch stop layer between the dummy gate structure and the resistive structure. The etch stop layer includes a lower etch stop layer and an upper etch stop layer, which are formed of different materials.
Abstract:
A memory module includes a first rank, a second rank and a test control unit. The first rank includes a plurality of semiconductor memory devices configured to operate in response to a first chip selection signal. The second rank includes a plurality of semiconductor memory devices configured to operate in response to a second chip selection signal. The test control unit is configured to simultaneously enable the first and second chip selection signals to test the first and second ranks in a test mode.