公开(公告)号：US10823779B2

公开(公告)日：2020-11-03

申请号：US15964842

申请日：2018-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchul Lee ,  Semin Kwon ,  JinHwan Lee ,  Jea-Muk Oh ,  Kyungsook Lee ,  Nam-Hong Lee

IPC: G01R31/26 ,  H05K13/02 ,  B65G1/04 ,  G01R31/28 ,  G01R1/04

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

公开(公告)号：US09285416B2

公开(公告)日：2016-03-15

申请号：US13799146

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchul Lee ,  Semin Kwon ,  JinHwan Lee ,  Jea-Muk Oh ,  Kyungsook Lee ,  Nam-Hong Lee

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2893 ,  G01R1/0433 ,  G01R31/2808

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

Abstract translation: 基板制造装置包括测试装置，该测试装置包括用于在基板上执行测试处理的测试处理器模块。 测试处理器模块可以包括用于传送基板的传送单元，用于在基板上执行测试处理的处理器单元以及用于在输送单元和处理单元之间传送基板的转印单元。 输送单元可以包括进料输送机和与进料输送机隔开的排料输送机。

公开(公告)号：US09207272B2

公开(公告)日：2015-12-08

申请号：US14026168

申请日：2013-09-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Jea-Muk Oh ,  Sangil Kim ,  Byoungjun Min ,  Jongpil Park

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/2865 ,  G01R31/2874

Abstract: A test handler and a test method of a semiconductor device using the same includes a plurality of chambers to provide a sealed inner space accommodating a first tray on which semiconductor devices are mounted, a test module electrically connected to the semiconductor devices in the chambers to perform a test process of the semiconductor devices, and a sort part to load and unload the first tray in the chambers and to sort semiconductor devices determined to be failed in the test process. The plurality of chambers have a fluid path circulating a coolant or a heat medium in the walls so that a temperature of the plurality of chambers is rapidly changed at the test process of the semiconductor devices between a first temperature that is less than room temperature and a second temperature that is greater than room temperature.

Abstract translation: 使用该半导体器件的半导体器件的测试处理器和测试方法包括多个室以提供容纳其上安装有半导体器件的第一托盘的密封内部空间，测试模块电连接到腔室中的半导体器件以执行 半导体器件的测试过程，以及用于加载和卸载腔室中的第一托盘的分类部件，并且在测试过程中对被确定为失败的半导体器件进行分类。 多个室具有在壁中循环冷却剂或热介质的流体路径，使得在半导体器件的测试过程中，在小于室温的第一温度和 第二温度大于室温。