公开(公告)号：US10823779B2

公开(公告)日：2020-11-03

申请号：US15964842

申请日：2018-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchul Lee ,  Semin Kwon ,  JinHwan Lee ,  Jea-Muk Oh ,  Kyungsook Lee ,  Nam-Hong Lee

IPC: G01R31/26 ,  H05K13/02 ,  B65G1/04 ,  G01R31/28 ,  G01R1/04

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

公开(公告)号：US09285416B2

公开(公告)日：2016-03-15

申请号：US13799146

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchul Lee ,  Semin Kwon ,  JinHwan Lee ,  Jea-Muk Oh ,  Kyungsook Lee ,  Nam-Hong Lee

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2893 ,  G01R1/0433 ,  G01R31/2808

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

Abstract translation: 基板制造装置包括测试装置，该测试装置包括用于在基板上执行测试处理的测试处理器模块。 测试处理器模块可以包括用于传送基板的传送单元，用于在基板上执行测试处理的处理器单元以及用于在输送单元和处理单元之间传送基板的转印单元。 输送单元可以包括进料输送机和与进料输送机隔开的排料输送机。