公开(公告)号：US10823779B2

公开(公告)日：2020-11-03

申请号：US15964842

申请日：2018-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchul Lee ,  Semin Kwon ,  JinHwan Lee ,  Jea-Muk Oh ,  Kyungsook Lee ,  Nam-Hong Lee

IPC: G01R31/26 ,  H05K13/02 ,  B65G1/04 ,  G01R31/28 ,  G01R1/04

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

公开(公告)号：US09285416B2

公开(公告)日：2016-03-15

申请号：US13799146

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchul Lee ,  Semin Kwon ,  JinHwan Lee ,  Jea-Muk Oh ,  Kyungsook Lee ,  Nam-Hong Lee

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2893 ,  G01R1/0433 ,  G01R31/2808

Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

Abstract translation: 基板制造装置包括测试装置，该测试装置包括用于在基板上执行测试处理的测试处理器模块。 测试处理器模块可以包括用于传送基板的传送单元，用于在基板上执行测试处理的处理器单元以及用于在输送单元和处理单元之间传送基板的转印单元。 输送单元可以包括进料输送机和与进料输送机隔开的排料输送机。

公开(公告)号：US20140306727A1

公开(公告)日：2014-10-16

申请号：US14146119

申请日：2014-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungsook Lee ,  Jongpil Park ,  Kwon-Bon Koo ,  Moon-Seok Kim ,  Byoungjun Min

IPC: G01R31/26 ,  G01R31/3187

CPC classification number: G01R31/2868

Abstract: A test facility may be used to test semiconductor devices. The test facility may include a stacker part configured to communicate with a server, wherein the server includes test programs for testing semiconductor devices, and a plurality of test board parts disposed in the stacker part, at least one of the test board parts including semiconductor devices disposed thereon and configured to provide at least one of the test programs from the server to the semiconductor devices. The stacker part may include unit stackers which include shelves configured to hold the plurality of test board parts and a stacker controller configured to communicate with the test board parts in the unit stackers and the server.

Abstract translation: 测试设备可用于测试半导体器件。 测试设备可以包括配置成与服务器通信的堆叠器部件，其中服务器包括用于测试半导体器件的测试程序，以及设置在堆叠器部分中的多个测试板部件，至少一个测试板部件包括半导体器件 设置在其上并且被配置为提供从服务器到半导体器件的测试程序中的至少一个。 堆垛机部分可以包括单元堆垛机，其包括被配置为保持多个测试板部件的搁架和被配置为与单元堆垛机和服务器中的测试板部件通信的堆垛机控制器。