Test board and test apparatus including a multi-type fluid supplier for testing electronic apparatuses having semiconductor devices

    公开(公告)号:US11422158B2

    公开(公告)日:2022-08-23

    申请号:US16943632

    申请日:2020-07-30

    Abstract: A test board and a test apparatus having the same are disclosed. The test board includes a base plate including a connector and a plurality of mounting areas in a matrix shape having a mounting row in a first direction and a mounting column in a second direction, a plurality of test units arranged on the mounting areas of the base plate and a test object is mounted in each of the mounting areas, and a fluid supplier disposed on the base plate and supplying a test fluid to each of the test units having a test temperature and a supplementary fluid to the test object to reduce a temperature difference between an actual temperature of the test object and the test temperature such that the actual temperature of the test objects is substantially below the test temperature.

    Apparatus and method for manufacturing substrates
    4.
    发明授权
    Apparatus and method for manufacturing substrates 有权
    用于制造基板的装置和方法

    公开(公告)号:US09285416B2

    公开(公告)日:2016-03-15

    申请号:US13799146

    申请日:2013-03-13

    CPC classification number: G01R31/2893 G01R1/0433 G01R31/2808

    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.

    Abstract translation: 基板制造装置包括测试装置,该测试装置包括用于在基板上执行测试处理的测试处理器模块。 测试处理器模块可以包括用于传送基板的传送单元,用于在基板上执行测试处理的处理器单元以及用于在输送单元和处理单元之间传送基板的转印单元。 输送单元可以包括进料输送机和与进料输送机隔开的排料输送机。

    Electronic device including window for optical module

    公开(公告)号:US11902639B2

    公开(公告)日:2024-02-13

    申请号:US17702946

    申请日:2022-03-24

    CPC classification number: H04N23/51 G03B30/00 H04N23/54 H04N23/55 H04N23/57

    Abstract: According to certain embodiments of the disclosure, an electronic device may include a housing, a window frame disposed in the housing and providing at least one opening exposing an inside of the housing to an outside of the housing, at least one window coupled to the window frame to close the at least one opening, and at least one optical module disposed inside the housing and configured to receive external light incident through the at least one window. The at least one window may include an inner surface facing the inside of the housing, a side surface facing an inner wall of the at least one opening, and a first inclined surface connecting the side surface to the inner surface. The first inclined surface may be inclined with respect to the inner surface and the side surface and may be bonded to the inner wall. Other various embodiments are possible as well.

    TEST BOARD AND TEST APPARATUS FOR TESTING ELECTRONIC APPARATUSES HAVING SEMICONDUCTOR DEVICES

    公开(公告)号:US20210172979A1

    公开(公告)日:2021-06-10

    申请号:US16943632

    申请日:2020-07-30

    Abstract: A test board and a test apparatus having the same are disclosed. The test board includes a base plate including a connector and a plurality of mounting areas in a matrix shape having a mounting row in a first direction and a mounting column in a second direction, a plurality of test units arranged on the mounting areas of the base plate and a test object is mounted in each of the mounting areas, and a fluid supplier disposed on the base plate and supplying a test fluid to each of the test units having a test temperature and a supplementary fluid to the test object to reduce a temperature difference between an actual temperature of the test object and the test temperature such that the actual temperature of the test objects is substantially below the test temperature.

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