公开(公告)号：US20220130782A1

公开(公告)日：2022-04-28

申请号：US17389841

申请日：2021-07-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Ho AHN ,  Ji Won KIM ,  Sung-Min HWANG ,  Joon-Sung LIM ,  Suk Kang SUNG

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L23/535 ,  H01L21/768 ,  H01L25/00

Abstract: A semiconductor memory device includes a first substrate including opposite first and second surfaces, a mold structure including gate electrodes stacked on the first surface of the first substrate, a channel structure through the mold structure, a first contact via penetrating the first substrate, a second substrate including opposite third and fourth surfaces, a circuit element on the third surface of the second substrate, a first through-via through the mold structure connecting the first contact via and the circuit element, the first through-via including a first conductive pattern, and a first spacer separating the first conductive pattern from the mold structure, and a second through-via through the mold structure and spaced apart from the first through-via, the second through-via including a second conductive pattern, and a second spacer separating the second conductive pattern from the first substrate and the mold structure.

公开(公告)号：US20170161185A1

公开(公告)日：2017-06-08

申请号：US15365991

申请日：2016-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： JUNG SIK CHOI ,  Hwan Soo HAN ,  Ji Won KIM

IPC: G06F12/02

CPC classification number: G06F12/0238 ,  G06F12/0246 ,  G06F12/1441 ,  G06F2212/202 ,  G06F2212/7201 ,  G06F2212/7207

Abstract: A memory mapping management method for a system using nonvolatile memory (NVM) as main memory, including receiving a request to cancel a memory mapping, determining whether the memory mapping is a mapping of a file based on meta data relating to the memory mapping, separately storing the meta data when the memory mapping is the mapping of the file, and cancelling the memory mapping when the memory mapping is not the mapping of the file may be provided. Further, the memory mapping management method may include receiving a memory mapping request, searching for a memory mapping for a file in a memory mapping storage space when a requested memory mapping is a mapping of the file, and reusing a searched memory mapping found during the search when a region of the searched memory mapping includes a region required by the requested memory mapping in a virtual address space.

公开(公告)号：US20160168398A1

公开(公告)日：2016-06-16

申请号：US14753378

申请日：2015-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Euy Hyun CHO ,  Ji Yun KANG ,  Ji Won KIM ,  Sung Ha PARK ,  Beom Seok LEE

IPC: C09D11/00 ,  G01N21/59 ,  G01N21/01

CPC classification number: C09D11/03 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/161 ,  C09D11/037 ,  G01N21/03 ,  G01N21/77 ,  G01N33/53 ,  G01N2021/0325 ,  G01N2021/0346

Abstract: Disclosed herein are a structure for optical analysis that is capable of optically analyzing a small amount of a sample and an ink composition for manufacturing the same. A structure for optical analysis includes a support and an ink structure coupled to the support and configured to form a chamber on one surface of the support. The ink structure includes a first ink structural component configured to form a body of the ink structure and a second ink structural component formed at a lower portion of a side surface of the first ink, such that the first ink structural component and the second ink structural component have different slopes with respect to a direction of a center of the chamber.

Abstract translation: 本文公开了能够光学分析少量样品的光学分析结构和用于制造该样品的油墨组合物。 用于光学分析的结构包括支撑件和联接到支撑件并被配置成在支撑件的一个表面上形成腔室的墨水结构。 油墨结构包括构造成形成油墨结构体的第一油墨结构部件和形成在第一油墨的侧表面的下部的第二油墨结构部件，使得第一油墨结构部件和第二油墨结构 部件相对于腔室的中心方向具有不同的斜率。

公开(公告)号：US20150213607A1

公开(公告)日：2015-07-30

申请号：US14603737

申请日：2015-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Ju JEONG ,  Ji Won KIM ,  Dong Kyung NAM ,  Du-Sik PARK ,  Yang Ho CHO ,  Hyo Seok HWANG

IPC: G06T7/00

CPC classification number: G06T7/97 ,  G06T2207/20228

Abstract: At least one example embodiment discloses an imaging apparatus that may receive input images with different viewpoints, obtain information associated with the input images, and generate a new viewpoint image based on the received input images and the obtained information and thus, reduce an information loss of the new viewpoint image for the input images.

Abstract translation: 至少一个示例性实施例公开了一种成像设备，其可以接收具有不同视点的输入图像，获得与输入图像相关联的信息，并且基于接收到的输入图像和所获得的信息生成新的视点图像，从而减少信息丢失 输入图像的新视点图像。

公开(公告)号：US20240064974A1

公开(公告)日：2024-02-22

申请号：US18386639

申请日：2023-11-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Ho AHN ,  Ji Won KIM ,  Sung-Min HWANG ,  Joon-Sung LIM ,  Suk Kang SUNG

IPC: H10B41/27 ,  H01L23/538 ,  H01L25/065 ,  H10B43/27

CPC classification number: H10B41/27 ,  H01L23/5384 ,  H01L25/0657 ,  H10B43/27

Abstract: A semiconductor memory device comprising: a first semiconductor chip including an upper input/output pad, a second semiconductor chip including a lower input/output pad, and a substrate attachment film attaching the first and second semiconductor chips. The first and second semiconductor chips each include a first substrate including a first side facing the substrate attachment film and a second side, a mold structure including gate electrodes, a channel structure penetrating the mold structure and intersecting the gate electrodes, a second substrate including a third side facing the first side and a fourth side, a first circuit element on the third side of the second substrate, and a contact via penetrating the first substrate and connected to the first circuit element. The upper and lower input/output pads are on the second sides of the first and second semiconductor chip, respectively, and contact the contact vias of the first and second semiconductor chips.

公开(公告)号：US20220123006A1

公开(公告)日：2022-04-21

申请号：US17340148

申请日：2021-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Ho AHN ,  Ji Won KIM ,  Sung-Min HWANG ,  Joon-Sung LIM ,  Suk Kang SUNG

IPC: H01L27/11556 ,  H01L25/065 ,  H01L27/11582 ,  H01L23/538

Abstract: A semiconductor memory device comprising: a first semiconductor chip including an upper input/output pad, a second semiconductor chip including a lower input/output pad, and a substrate attachment film attaching the first and second semiconductor chips. The first and second semiconductor chips each include a first substrate including a first side facing the substrate attachment film and a second side, a mold structure including gate electrodes, a channel structure penetrating the mold structure and intersecting the gate electrodes, a second substrate including a third side facing the first side and a fourth side, a first circuit element on the third side of the second substrate, and a contact via penetrating the first substrate and connected to the first circuit element. The upper and lower input/output pads are on the second sides of the first and second semiconductor chip, respectively, and contact the contact vias of the first and second semiconductor chips.

公开(公告)号：US20210311552A1

公开(公告)日：2021-10-07

申请号：US17353957

申请日：2021-06-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Gu LEE ,  Ji Won KIM ,  Young Hak OH ,  Sun Young YI ,  Won Jun LEE ,  Kyu Ok CHOI

IPC: G06F3/01 ,  G08B6/00 ,  G06F1/16

Abstract: An electronic device includes a communication circuit to communicate with at least one wearable device, and at least one processor electrically connected with the communication circuit. The at least one processor is configured to obtain position information on a position on which the at least one wearable device is placed on a user's body, and to transmit a control signal to the at least one wearable device through the communication circuit such that, when an output of a haptic pattern specified based on a function is requested, the at least one wearable device outputs a haptic feedback corresponding to the position information and the specified haptic pattern.

公开(公告)号：US20220115344A1

公开(公告)日：2022-04-14

申请号：US17405637

申请日：2021-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Won KIM ,  Jae Ho AHN ,  Sung-Min HWANG ,  Joon-Sung LIM ,  Suk Kang SUNG

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00

Abstract: The nonvolatile memory device includes a substrate including a first surface and a second surface opposite to the first surface in a first direction; a common source line on the first surface of the substrate; a plurality of word lines stacked on the common source line; a first insulating pattern spaced apart from the plurality of word lines in a second direction crossing the first direction, and in the substrate; an insulating layer on the second surface of the substrate; a first contact plug penetrating the first insulating pattern and extending in the first direction; a second contact plug penetrating the insulating layer, extending in the first direction, and connected to the first contact plug; an upper bonding metal connected to the first contact plug and connected to a circuit element; and a first input/output pad connected to the second contact plug and electrically connected to the circuit element.

公开(公告)号：US20190155388A1

公开(公告)日：2019-05-23

申请号：US16194488

申请日：2018-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Gu LEE ,  Ji Won KIM ,  Young Hak OH ,  Sun Young YI ,  Won Jun LEE ,  Kyu Ok CHOI

IPC: G06F3/01 ,  G08B6/00 ,  G06F1/16

Abstract: An electronic device includes a communication circuit to communicate with at least one wearable device, and at least one processor electrically connected with the communication circuit. The at least one processor is configured to obtain position information on a position on which the at least one wearable device is placed on a user's body, and to transmit a control signal to the at least one wearable device through the communication circuit such that, when an output of a haptic pattern specified based on a function is requested, the at least one wearable device outputs a haptic feedback corresponding to the position information and the specified haptic pattern.

公开(公告)号：US20190148968A1

公开(公告)日：2019-05-16

申请号：US16189824

申请日：2018-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Zo KIM ,  Kwang Seob KIM ,  Ji Won KIM ,  Hye Won KIM ,  Chang Hak O ,  Kyung Woo LIM ,  Byeong Hyun JANG ,  Kuk Hwan JUNG ,  Hyung Koo CHUNG ,  Se Hyun CHO ,  Min Cheol HA ,  Yong Sang YUN

IPC: H02J7/02 ,  H02J50/12 ,  H04B5/00 ,  H02J50/80

Abstract: An electronic device includes a battery, a power regulator electrically connected with the battery and including an input terminal and an output terminal, a connector electrically connected with the input terminal, a wireless power transmitting circuit electrically connected with the output terminal, a switch electrically connected between the connector and the wireless power transmitting circuit, and a controller configured to identify an approaching external electronic device or a wireless charging-related request, identify whether power is provided from an external power supply via the connector in response to the identification, in response to identifying that power is not provided from the external power supply, supply power from the battery via the power regulator to the wireless power transmitting circuit, and in response to identifying that power is provided from the external power supply, supply the power provided from the external power supply to the wireless power transmitting circuit via the switch.