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公开(公告)号：US11791579B2
公开(公告)日：2023-10-17
申请号：US17392763
申请日：2021-08-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyung-Suk Kim , Chung Hyun Ryu , So-Young Jung , Ji Yong Kim , Jin Wook Song
CPC classification number: H01R12/721 , H01R13/26 , H05K1/117 , H01R12/73 , H01R13/03 , H05K2201/09909
Abstract: A electronic device including a host connector and memory device is provided. The host connector includes a connector pin, and the memory connector includes a connection terminal electrically connected to the connector pin of the host connector. The connector pin includes a first conductor part including a conductor, a second conductor part including the conductor, the second conductor part being bent from the first conductor part in a direction towards the connection terminal, and a stub including an insulator, the stub being bent from the second conductor part in a direction away from the connection terminal. The connection terminal includes a first region including an insulator, and a second region including a conductor. The second conductor part is electrically connected to the second region, so that the host connector is electrically connected to the memory connector.
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公开(公告)号：US11682827B2
公开(公告)日：2023-06-20
申请号：US17693501
申请日：2022-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji Hoon Kim , Ji Yong Kim , Jong In Lee , Yeon Jeong Kim , Yong Jun An , Hyo Seok Na
IPC: H01Q1/24 , H01Q1/22 , H01Q23/00 , H01Q21/00 , H01Q9/04 , H01L23/66 , H01P5/18 , H01Q5/335 , H01Q21/06
CPC classification number: H01Q1/2283 , H01L23/66 , H01P5/187 , H01Q1/24 , H01Q1/243 , H01Q5/335 , H01Q9/0407 , H01Q9/0414 , H01Q21/0031 , H01Q21/0093 , H01Q21/065 , H01Q23/00 , H01L2223/6627 , H01L2223/6677
Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.
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公开(公告)号：US10447898B2
公开(公告)日：2019-10-15
申请号：US15617516
申请日：2017-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyu Ik Cho , Ji Yong Kim , Jae Jung Park
IPC: H04N3/14 , H04N5/369 , H04N5/3745 , H04N5/335 , H04N5/341
Abstract: An image sensor is provided. The image sensor may include an active pixel electrically connected to a column line and configured to provide an output voltage to a pixel node and a bias circuit electrically connected between the pixel node and an earth terminal, and in which a first current flows through a first line electrically connected to the pixel node, wherein the bias circuit includes a first variable capacitor electrically connected to a power supply voltage, and a second variable capacitor electrically connected to the earth terminal, and the magnitude of the first current may be configured to vary based on a ratio of a capacitance of the first variable capacitor to a capacitance of the second variable capacitor. The output voltage may be configured to be adjusted based on the magnitude of the first current.
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Patent Agency Ranking
公开(公告)号：US11272079B2
公开(公告)日：2022-03-08
申请号：US16560486
申请日：2019-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyu Ik Cho , Ji Yong Kim , Jae Jung Park
Abstract: An image sensor is provided. The image sensor may include an active pixel electrically connected to a column line and configured to provide an output voltage to a pixel node and a bias circuit electrically connected between the pixel node and an earth terminal, and in which a first current flows through a first line electrically connected to the pixel node, wherein the bias circuit includes a first variable capacitor electrically connected to a power supply voltage, and a second variable capacitor electrically connected to the earth terminal, and the magnitude of the first current may be configured to vary based on a ratio of a capacitance of the first variable capacitor to a capacitance of the second variable capacitor. The output voltage may be configured to be adjusted based on the magnitude of the first current.
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公开(公告)号：US20190394359A1
公开(公告)日：2019-12-26
申请号：US16560486
申请日：2019-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyu Ik Cho , Ji Yong Kim , Jae Jung Park
IPC: H04N3/14
Abstract: An image sensor is provided. The image sensor may include an active pixel electrically connected to a column line and configured to provide an output voltage to a pixel node and a bias circuit electrically connected between the pixel node and an earth terminal, and in which a first current flows through a first line electrically connected to the pixel node, wherein the bias circuit includes a first variable capacitor electrically connected to a power supply voltage, and a second variable capacitor electrically connected to the earth terminal, and the magnitude of the first current may be configured to vary based on a ratio of a capacitance of the first variable capacitor to a capacitance of the second variable capacitor. The output voltage may be configured to be adjusted based on the magnitude of the first current.
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公开(公告)号：US11283151B2
公开(公告)日：2022-03-22
申请号：US16202596
申请日：2018-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji Hoon Kim , Ji Yong Kim , Jong In Lee , Yeon Jeong Kim , Yong Jun An , Hyo Seok Na
IPC: H01Q1/24 , H01Q1/22 , H01Q23/00 , H01Q21/00 , H01Q9/04 , H01L23/66 , H01P5/18 , H01Q5/335 , H01Q21/06
Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.
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公开(公告)号：US11212949B2
公开(公告)日：2021-12-28
申请号：US16824305
申请日：2020-03-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji Yong Kim , Sunk-Ki Lee , Su In Kim
Abstract: A solid state drive device is provided. The solid state drive device includes a lower plate which includes a lower flat part, and a lower side wall protruding from the lower flat part primarily in a first direction, an upper plate which includes an upper flat part facing the lower flat part, and an upper side wall protruding from the upper flat part primarily in a second direction opposite to the first direction. The solid state drive device further includes a gasket including a metal material formed in at least a part of a region in which the lower side wall and the upper side wall overlap each other.
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公开(公告)号：US20210037685A1
公开(公告)日：2021-02-04
申请号：US16824305
申请日：2020-03-19
Applicant: Samsung Electronics CO., LTD.
Inventor： Ji Yong Kim , Sunk-Ki Lee , Su In Kim
Abstract: A solid state drive device is provided. The solid state drive device includes a lower plate which includes a lower flat part, and a lower side wall protruding from the lower flat part primarily in a first direction, an upper plate which includes an upper flat part facing the lower flat part, and an upper side wall protruding from the upper flat part primarily in a second direction opposite to the first direction. The solid state drive device further includes a gasket including a metal material formed in at least a part of a region in which the lower side wall and the upper side wall overlap each other.
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