公开(公告)号：US20140162406A1

公开(公告)日：2014-06-12

申请号：US13919460

申请日：2013-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-hyoung CHO ,  Jun-hee CHOI ,  Jin-seung SOHN

IPC: H01L21/56 ,  H01L29/40

CPC classification number: H01L21/568 ,  H01L21/6835 ,  H01L2221/6835 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a method of transferring semiconductor elements formed on a non-flexible substrate to a flexible substrate. Also, provided is a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. A semiconductor element grown or formed on the substrate may be efficiently transferred to the resin layer while maintaining an arrangement of the semiconductor elements. Furthermore, the resin layer acts as a flexible substrate supporting the vertical semiconductor elements.

Abstract translation: 提供了将形成在非柔性基板上的半导体元件转移到柔性基板的方法。 此外，提供了一种基于半导体元件的传输方法制造柔性半导体器件的方法。 在保持半导体元件的配置的同时，可以在衬底上生长或形成的半导体元件被有效地转移到树脂层。 此外，树脂层用作支撑垂直半导体元件的柔性基板。

公开(公告)号：US20140242782A1

公开(公告)日：2014-08-28

申请号：US14077956

申请日：2013-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-hyoung CHO ,  Jun-Hee CHOI ,  Jin-seung SOHN ,  Chang-youl MOON

IPC: H01L21/78 ,  H01L21/82 ,  H01L21/02 ,  H01L21/28

CPC classification number: H01L21/7806 ,  H01L21/02343 ,  H01L21/28 ,  H01L21/82 ,  H01L23/3192 ,  H01L27/153 ,  H01L31/035281 ,  H01L31/03926 ,  H01L31/1848 ,  H01L31/1856 ,  H01L31/1892 ,  H01L31/1896 ,  H01L33/0079 ,  H01L33/02 ,  H01L33/32 ,  H01L33/44 ,  H01L2933/0016 ,  H01S5/0217 ,  H01S5/32341 ,  Y02E10/544 ,  Y02P70/521

Abstract: The present disclosure relates to a method of transferring semiconductor elements from a non-flexible substrate to a flexible substrate. The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements grown or formed on a non-flexible substrate may be effectively transferred to a resin layer while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements.

Abstract translation: 本公开涉及将半导体元件从非柔性基板转移到柔性基板的方法。 本公开还涉及一种基于传送半导体元件的方法制造柔性半导体器件的方法。 在非柔性基板上生长或形成的半导体元件可以有效地转移到树脂层，同时保持半导体元件的布置。 树脂层可以用作用于支撑垂直半导体元件的柔性基板。

公开(公告)号：US20140140045A1

公开(公告)日：2014-05-22

申请号：US13849703

申请日：2013-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-seung SOHN ,  Eun-hyoung CHO

IPC: F21V13/08

CPC classification number: F21V13/08 ,  G02F1/133528 ,  G02F1/133553 ,  G02F2001/133565 ,  G02F2001/133607

Abstract: A display panel may include a plurality of opening regions controlling one of transmission and blocking of incident light to form an image, a non-opening region between the plurality of opening regions, the non-opening region configured to not transmit the incident light, and at least one oblique reflective plate in the non-opening region to obliquely reflect the incident light.

Abstract translation: 显示面板可以包括控制入射光的透射和阻挡之一以形成图像的多个开口区域，多个开口区域之间的非开放区域，被配置为不透射入射光的非开口区域，以及 在非开口区域中的至少一个倾斜反射板，以倾斜地反射入射光。

公开(公告)号：US20130115420A1

公开(公告)日：2013-05-09

申请号：US13685365

申请日：2012-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-hoon PARK ,  Eun-hyoung CHO ,  Jin-seung SOHN ,  Dong-earn KIM ,  Dong-ouk KIM ,  Ha-jin KIM ,  Min-jong BAE ,  Yoon-chul SON ,  Sang-eui LEE ,  Kun-mo CHU

IPC: B32B3/30

CPC classification number: B32B3/30 ,  B82Y30/00 ,  Y10T428/24355

Abstract: A nano composite with superhydrophobic surfaces including a bulk portion and a surface portion having a superhydrophobic pattern, wherein the bulk portion and the surface portion include the same material, and methods of manufacturing of the nano composite.

Abstract translation: 一种具有超疏水表面的纳米复合材料，其包括本体部分和具有超疏水图案的表面部分，其中本体部分和表面部分包括相同的材料，以及纳米复合材料的制造方法。