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    FUSING APPARATUS AND METHOD
    1.
    发明申请
    FUSING APPARATUS AND METHOD 审中-公开
    熔接设备和方法

    公开(公告)号：US20140072353A1

    公开(公告)日：2014-03-13

    申请号：US13923472

    申请日：2013-06-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dong-earn KIM ,  Dong-ouk KIM ,  Ha-jin KIM ,  Sung-hoon PARK ,  Min-jong BAE ,  Yoon-chul SON ,  Sang-eui LEE ,  Kun-mo CHU ,  In-taek HAN

    IPC: G03G15/20

    CPC classification number: G03G15/2053 ,  G03G15/2017 ,  G03G15/2032

    Abstract: A fusing apparatus including a heating unit including a heater having a substantially flat shape; a nip forming unit which faces the heating unit and forms a fusing nip with the heating unit; and a driving unit which moves the heating unit to alternately repeat a forward motion whereby the heating unit moves forward in a moving direction of the recording medium, when the fusing nip is formed, and a returning motion whereby the heating unit moves backward in a direction opposite to the moving direction of the recording medium, when the fusing nip is released.

    Abstract translation: 一种定影装置，包括：加热单元，其包括具有基本平坦形状的加热器; 辊隙形成单元，其面对加热单元并与加热单元形成定影辊隙; 以及驱动单元，其移动加热单元以交替地重复向前运动，由此加热单元在记录介质的移动方向上移动时，当形成定影夹持时，以及返回动作，由此加热单元沿着方向向后移动 与记录介质的移动方向相反，当定影辊隙被释放时。

    METAL-BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATERIALS
    3.
    发明申请
    METAL-BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATERIALS 审中-公开
    基于金属的焊接复合材料，包括导电自愈材料

    公开(公告)号：US20140299231A1

    公开(公告)日：2014-10-09

    申请号：US14077846

    申请日：2013-11-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kun-mo CHU ,  Chang-youl MOON ,  Sung-hee LEE ,  Jun-sik HWANG

    IPC: B23K35/02

    CPC classification number: B23K35/0222 ,  B23K35/0244

    Abstract: A solder composite is provided. The solder composite may include: a metal-based solder matrix, a capsule dispersed in the solder matrix, and a self-healing material that is encapsulated in the capsule. The self-healing material may be configured to react with the solder matrix when in contact with the solder matrix such that at least one of an electrically conductive intermetallic compound and an electrically conductive alloy is formed.

    Abstract translation: 提供焊料复合材料。 焊料复合材料可以包括：金属基焊料基质，分散在焊料基质中的胶囊，以及封装在胶囊中的自修复材料。 自修复材料可以被配置为当与焊料基质接触时与焊料基质反应，使得形成导电金属间化合物和导电合金中的至少一种。

    HEATING MEMBER AND FUSING DEVICE INCLUDING THE SAME
    5.
    发明申请
    HEATING MEMBER AND FUSING DEVICE INCLUDING THE SAME 有权
    加热构件和加热装置，包括它们

    公开(公告)号：US20140126940A1

    公开(公告)日：2014-05-08

    申请号：US13904233

    申请日：2013-05-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yoon-chul SON ,  Dong-earn KIM ,  Dong-ouk KIM ,  Ha-jin KIM ,  Sung-hoon PARK ,  Min-jong BAE ,  Sang-eui LEE ,  Kun-mo CHU

    IPC: G03G15/20 ,  H05B3/03

    CPC classification number: H05B3/03 ,  G03G15/2042 ,  G03G15/2057 ,  G03G2215/2035 ,  H05B3/145 ,  H05B3/46 ,  H05B2214/04

    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.

    Abstract translation: 加热构件包括：电阻加热层，包括：介质通过区域和分别在电阻加热层的相对侧部处的介质通过区域的相对侧上的非介质通过区域; 支撑电阻加热层的芯体; 电阻加热层和芯之间的导热层，并且设置在电阻加热层的侧部的非介质通过区域中; 并且位于电阻加热层和芯之间的电极与电阻加热层的侧部接触并向电阻加热层提供电流。 导热层和电阻加热层之间的接触面积与其中设置导热层的非介质通过区域的面积的比率为约5％至约25％。

    HEATING MEMBER AND FUSING APPARATUS INCLUDING THE SAME
    8.
    发明申请
    HEATING MEMBER AND FUSING APPARATUS INCLUDING THE SAME 有权
    加热构件和加热装置，包括它们

    公开(公告)号：US20130251425A1

    公开(公告)日：2013-09-26

    申请号：US13848195

    申请日：2013-03-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoon-chul SON ,  Dong-earn KIM ,  Dong-ouk KIM ,  Ha-jin KIM ,  Sung-hoon PARK ,  Min-jong BAE ,  Sang-eui LEE ,  Kun-mo CHU ,  In-taek HAN

    IPC: G03G15/20 ,  H05B3/36 ,  H05B3/12

    CPC classification number: G03G15/2064 ,  G03G15/2057 ,  H05B3/12 ,  H05B3/146 ,  H05B3/36 ,  H05B3/38

    Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

    Abstract translation: 加热构件包括：电阻加热层，其在被供应电能时产生热量; 作为加热部件的最外层的剥离层，包含聚合物; 设置在电阻加热层和剥离层之间的中间层。 电阻加热层包括基础聚合物和分散在基础聚合物中的导电填料。 中间层包括与电阻加热层的基础聚合物或脱模层的聚合物相同类型的聚合物材料。

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