Abstract:
Provided are an acousto-optic element, an acousto-optic element array, and a display apparatus including the acousto-optic element array. The acousto-optic element includes: an acousto-optic modulator which includes an acousto-optic layer formed of an acousto-optic material; a light supplier which supplies light to the acousto-optic modulator in a first direction; a first sound-wave modulator which applies first elastic waves to the acousto-optic modulator in a second direction; and a second sound-wave modulator which applies second elastic waves to the acousto-optic modulator in a third direction. The light supplied from the light supplier to the acousto-optic modulator is deflected by diffraction caused by the first elastic waves applied from the first sound-wave modulator and diffraction caused by the second elastic waves applied from the second sound-wave modulator, and is output from the acousto-optic modulator through a front side of the acousto-optic modulator.
Abstract:
An optical film manufacturing method includes forming a master in which a shape corresponding to a plurality of micro-lens patterns is engraved, forming a low refractive index pattern layer in which the plurality of micro-lens patterns are formed, by using the master, forming a high refractive index material layer that has a higher refractive index than a refractive index of the low refractive index pattern layer, and imprinting the low refractive index pattern layer on the high refractive index material layer to form a high refractive index pattern layer, on a first surface of a substrate.
Abstract:
Provided are an acousto-optic element, an acousto-optic element array, and a display apparatus including the acousto-optic element array. The acousto-optic element includes: an acousto-optic modulator which includes an acousto-optic layer formed of an acousto-optic material; a light supplier which supplies light to the acousto-optic modulator in a first direction; a first sound-wave modulator which applies first elastic waves to the acousto-optic modulator in a second direction; and a second sound-wave modulator which applies second elastic waves to the acousto-optic modulator in a third direction. The light supplied from the light supplier to the acousto-optic modulator is deflected by diffraction caused by the first elastic waves applied from the first sound-wave modulator and diffraction caused by the second elastic waves applied from the second sound-wave modulator, and is output from the acousto-optic modulator through a front side of the acousto-optic modulator.
Abstract:
Provided is a method of transferring semiconductor elements formed on a non-flexible substrate to a flexible substrate. Also, provided is a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. A semiconductor element grown or formed on the substrate may be efficiently transferred to the resin layer while maintaining an arrangement of the semiconductor elements. Furthermore, the resin layer acts as a flexible substrate supporting the vertical semiconductor elements.
Abstract:
A display panel may include a plurality of opening regions controlling one of transmission and blocking of incident light to form an image, a non-opening region between the plurality of opening regions, the non-opening region configured to not transmit the incident light, and at least one oblique reflective plate in the non-opening region to obliquely reflect the incident light.
Abstract:
A nano composite with superhydrophobic surfaces including a bulk portion and a surface portion having a superhydrophobic pattern, wherein the bulk portion and the surface portion include the same material, and methods of manufacturing of the nano composite.
Abstract:
The present disclosure relates to a method of transferring semiconductor elements from a non-flexible substrate to a flexible substrate. The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements grown or formed on a non-flexible substrate may be effectively transferred to a resin layer while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements.