公开(公告)号：US20240074051A1

公开(公告)日：2024-02-29

申请号：US18503974

申请日：2023-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghyun SEOK ,  Kyeongseon PARK

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K2201/09409

Abstract: A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.

公开(公告)号：US20220418105A1

公开(公告)日：2022-12-29

申请号：US17672979

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyun SEOK ,  Kyeongseon PARK

IPC: H05K1/11

Abstract: A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.

公开(公告)号：US20230061451A1

公开(公告)日：2023-03-02

申请号：US17852556

申请日：2022-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyun SEOK ,  Kyongseon PARK

IPC: H01L25/065 ,  H05K1/18 ,  G11C5/06 ,  H05K3/34

Abstract: A memory module includes a printed circuit board (PCB) including a multi-layer having a wiring structure formed therein. A length of the PCB in a first direction is longer than a length of the PCB in a second direction perpendicular to the first direction. A plurality of memory chips includes a plurality of solder balls. The plurality of memory chips is arranged in a first row and a second row respectively extending in the first direction on the PCB. The plurality of solder balls is continuously arranged in the first direction. The wiring structure alternately zigzag-connects the plurality of memory chips arranged in the first row and the second row.

公开(公告)号：US20220206968A1

公开(公告)日：2022-06-30

申请号：US17383056

申请日：2021-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonghyeon CHO ,  Yongsuk KWON ,  Kyungsoo KIM ,  Jonghoon KIM ,  Jonghyun SEOK ,  Jonggeon LEE

IPC: G06F13/16 ,  G06F13/40 ,  G11C7/10 ,  G11C5/06

Abstract: A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.