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公开(公告)号：US20240282576A1
公开(公告)日：2024-08-22
申请号：US18535594
申请日：2023-12-11
发明人： Hyungju RYU , Sangjin KIM , Yigwon KIM , Jongsu KIM
IPC分类号： H01L21/027 , G03F7/00 , H01L21/304
CPC分类号： H01L21/0274 , G03F7/70625 , G03F7/70633 , H01L21/3043
摘要： A method of manufacturing a semiconductor device includes bonding a first semiconductor substrate on a second semiconductor substrate; performing a first physical parameter measurement on a first surface of the first semiconductor substrate to obtain first displacement data; polishing the first surface of the first semiconductor substrate after the first displacement data is obtained; performing a second physical parameter measurement on the polished first surface of the first semiconductor substrate to obtain second displacement data; and forming circuit patterns on the polished first surface of the first semiconductor substrate based on the second displacement data.
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公开(公告)号：US20240321884A1
公开(公告)日：2024-09-26
申请号：US18442590
申请日：2024-02-15
发明人： Inhyun SONG , Junggil YANG , Sangmoon LEE , Myunggil KANG , Jongsu KIM , Beomjin PARK
IPC分类号： H01L27/092 , H01L21/8238 , H01L29/06 , H01L29/423 , H01L29/49 , H01L29/66 , H01L29/775 , H01L29/786
CPC分类号： H01L27/092 , H01L21/823807 , H01L21/823842 , H01L29/0673 , H01L29/42392 , H01L29/4908 , H01L29/66439 , H01L29/775 , H01L29/78696
摘要： Provided is a semiconductor device including a substrate, a fin-type active region protruding on the substrate, a channel region on the fin-type active region and including a plurality of active patterns extending in a first horizontal direction and a semiconductor material layer, a gate line extending in a second horizontal direction that is perpendicular to the first horizontal direction and covering the channel region on the fin-type active region, and a pair of source/drain regions at both sides of the gate line on the fin-type active region, wherein a work function of the semiconductor material layer is different from a work function of the plurality of active patterns, the semiconductor material layer surrounds portions of the gate line between the plurality of active patterns, and the gate line is separated from the pair of source/drain regions with the semiconductor material layer therebetween.
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3.发明申请公开(公告)号：US20210074594A1
公开(公告)日：2021-03-11
申请号：US16847727
申请日：2020-04-14
发明人： Junbum PARK , Younghwan KIM , Jongsu KIM , Youngjoo LEE , Yoojin JEONG
摘要： A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.
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公开(公告)号：US20200319025A1
公开(公告)日：2020-10-08
申请号：US16751356
申请日：2020-01-24
发明人： Jongsu KIM , Younghwan KIM , Junbum PARK , Youngjoo LEE , Sungho JANG
摘要： An optical emission spectroscopy (OES) calibration system includes a chamber, an adapter, an OES device, a calibration device, and a spectrometer. The chamber includes a viewport. The adapter is fastened to the viewport, and includes a first beam splitter and a second beam splitter. The OES device detects plasma light generated in the chamber and transmitted through the adapter and generates OES data based on the detected plasma light. The calibration device includes a light source, and generates correction data for compensating for deviations in the OES data. The spectrometer detects light emitted from the light source and split by the first beam splitter or the second beam splitter. Each of the OES device, the calibration device, and the spectrometer is fastened to the adapter through an optical cable, and the calibration device generates the correction data using an intensity of light detected by the spectrometer.
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公开(公告)号：US20230114336A1
公开(公告)日：2023-04-13
申请号：US17903564
申请日：2022-09-06
发明人： Gawon LEE , Daehaeng CHO , Seunghyeon CHO , Jongsu KIM
IPC分类号： G06Q20/40
摘要： An electronic device is provided. The electronic device includes a communication module communicable with an external device, a display, a memory, and at least one processor operatively connected to the communication module, wherein the at least one processor is configured to display at least one image and/or text related to payment information on the display in response to at least a part of a user input, determine whether to start a payment process in response to identification of a user authentication, transmit a first signal for requesting an authentication to the external device in response to identification of an approach of the external device within a predetermined distance from the electronic device, and transmit a second signal related to the payment process in response to identification of an authentication of the external device, and determine whether to complete the payment process using the electronic device.
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公开(公告)号：US20240208005A1
公开(公告)日：2024-06-27
申请号：US18226873
申请日：2023-07-27
发明人： Jubong LEE , Jongsu KIM , Sungyong PARK , Bongki PARK , Eunsun PARK , Hyunjoon PARK , Hoseop CHOI
IPC分类号： B24B53/017 , B24B37/005 , B24B37/04
CPC分类号： B24B53/017 , B24B37/005 , B24B37/04
摘要： A cleaner for a CMP apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. The cleaning body may be arranged under a polishing head of the CMP apparatus configured to hold a substrate. The cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. The cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. The vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. The controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. Thus, a scratch caused by a defect may not be generated at the substrate.
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公开(公告)号：US20210341396A1
公开(公告)日：2021-11-04
申请号：US17116708
申请日：2020-12-09
发明人： Sungha KIM , Hyounggon KIM , Doohyun CHO , Kwangsung LEE , Jongsu KIM , Taejoong KIM , Jeongsu HA
摘要： A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.
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公开(公告)号：US20240355883A1
公开(公告)日：2024-10-24
申请号：US18385537
申请日：2023-10-31
发明人： Hyumin YOO , Myung Gil KANG , Dongwon KIM , Jongsu KIM , Beomjin PARK , Byeonghee SON
IPC分类号： H01L29/08 , H01L21/8238 , H01L27/092 , H01L29/775 , H01L29/786
CPC分类号： H01L29/0847 , H01L21/823814 , H01L27/092 , H01L29/775 , H01L29/78696 , H01L29/0653
摘要： A semiconductor device includes a substrate including an active pattern; a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns, which are stacked to be spaced apart from each other; a source/drain pattern connected to the plurality of semiconductor patterns; a gate electrode on the plurality of semiconductor patterns; and a blocking layer between the source/drain pattern and the active pattern, wherein the source/drain pattern includes a protruding side surface protruding toward the semiconductor patterns, the blocking layer includes silicon-germanium (SiGe), and a germanium concentration of the blocking layer is higher than a germanium concentration of the source/drain pattern.
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9.发明公开公开(公告)号：US20230166299A1
公开(公告)日：2023-06-01
申请号：US17870340
申请日：2022-07-21
发明人： Jongsu KIM , Johnho KUK , Sunil PARK , Kwangsung LEE , Yoichiro IWA , Sewon JEON , Youngho JUNG
IPC分类号： B08B3/02 , B24B37/005
CPC分类号： B08B3/02 , B24B37/0053
摘要： A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.
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公开(公告)号：US20230029025A1
公开(公告)日：2023-01-26
申请号：US17848905
申请日：2022-06-24
发明人： Donghoon LEE , Hakhyun KIM , Daehaeng CHO , Eunyoung KWON , Jongsu KIM
摘要： According to certain embodiments, an electronic device comprises: a secure element storing at least one content application and backup data associated with the at least one content application; a memory storing instructions; and a processor electrically connected to the secure element and the memory and configured to executed the instructions, wherein execution of the instructions by the processor causes the processor to perform a plurality of operations comprising: when receiving a message requesting a backup operation from an external electronic device, loading encrypted backup data from the secure element, transmitting the backup data to the external electronic device, and when receiving a message about backup completion from the external electronic device, setting the backup data to an unavailable state.
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