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公开(公告)号:US09613821B2
公开(公告)日:2017-04-04
申请号:US14695047
申请日:2015-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yool Kang , Dong-won Kim , Ju-young Kim , Tae-hoon Kim , Hye-ji Kim , Su-min Park , Hyung-rae Lee
IPC: H01L21/308 , H01L21/311 , H01L21/02 , H01L21/027 , H01L21/033 , H01L21/3213 , H01L27/108 , H01L21/768
CPC classification number: H01L21/3086 , H01L21/0273 , H01L21/0332 , H01L21/0337 , H01L21/3081 , H01L21/31144 , H01L21/32139 , H01L21/76816 , H01L27/10814 , H01L27/10855 , H01L27/10885 , H01L27/10888
Abstract: Provided are a method of forming patterns and a method of manufacturing an integrated circuit device. In the method of forming patterns, a photoresist pattern having a first opening exposing a first region of a target layer is formed. A capping layer is formed at sidewalls of the photoresist pattern defining the first opening. An insoluble region is formed around the first opening by diffusing acid from the capping layer to the inside of the photoresist pattern. A second opening exposing a second region of the target layer is formed by removing a soluble region spaced apart from the first opening, with the insoluble region being interposed therebetween. The target layer is etched using the insoluble region as an etch mask.
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公开(公告)号:US10468250B2
公开(公告)日:2019-11-05
申请号:US15337145
申请日:2016-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ju-young Kim , Jeong-ju Park , Jin Park , Hai-sub Na
IPC: G03F7/40 , H01L21/033 , C11D1/00 , C11D11/00 , H01L21/027 , G03F7/42
Abstract: A rinse solution includes a surfactant and deionized water. The surfactant includes a compound having a branched structure, the compound having a branched structure including a hydrophobic group-containing main chain and a plurality of side chains that are branched from the main chain and have at least one hydrophilic functional group. A method of fabricating an integrated circuit device includes forming a photoresist pattern, followed by applying the rinse solution onto the photoresist pattern.
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