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公开(公告)号：US09859175B2
公开(公告)日：2018-01-02
申请号：US15142275
申请日：2016-04-29
发明人： Kiwook Song , Bum-Soo Kim , Kye Hyun Baek , Masayuki Tomoyasu , Eunwoo Lee , Jong Seo Hong
CPC分类号： H01L22/10 , G05B19/41875 , G05B2219/32234 , G05B2219/45031 , H01J37/3288 , H01J37/32972
摘要： Provided are substrate processing systems and methods of managing the same. The method may include displaying a notification for a preventive maintenance operation on a chamber, performing a maintenance operation on the chamber, performing a first optical test, and evaluating the preventive maintenance operation. The first optical test may include generating a reference plasma reaction, measuring a variation of intensity by wavelength for plasma light emitted from the reference plasma reaction, and calculating an electron density and an electron temperature from a ratio in intensity of the plasma light.
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公开(公告)号：US20240019380A1
公开(公告)日：2024-01-18
申请号：US18219494
申请日：2023-07-07
发明人： Kihong Chung , Kiwook Song , Seungryeol Oh , Chungsam Jun
CPC分类号： G01N21/9501 , G01N21/29 , G01N21/211 , G01N23/2251 , G01B15/02 , G01N21/8851 , G01B2210/56 , G01N2223/6116 , G01N2021/213 , G01N2021/8864 , H01L22/12
摘要： A substrate inspection method includes radiating light onto a substrate, extracting a spectrum representing an intensity of light according to a wavelength from a light reflected from the substrate, analyzing the extracted spectrum in units of each of an entire substrate, a shot, a chip, and a block, generating a spectrum distribution map indicating reflectivity for each wavelength band by using the analyzed spectrum, and extracting a weak point in the substrate based on the spectrum distribution map.
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