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公开(公告)号：US20250061560A1
公开(公告)日：2025-02-20
申请号：US18798487
申请日：2024-08-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minsu Kang , Kwang-Eun Kim , HuiSoo Kim , Seum Seo , Jeongho Ahn , Sungeun Lee , Chaeyoung Lee , Choonshik Leem , Woojin Jung
Abstract: A parameter optimization method includes receiving a plurality of SEM images respectively corresponding to a plurality of positions on a semiconductor wafer in which a first pattern and a second pattern are disposed based on overlay settings, determining a primary optimization parameter set based on the plurality of SEM images, clustering the plurality of SEM images to a plurality of clusters based on image attributes, and determining a secondary optimization parameter set corresponding to each of the plurality of clusters based on SEM images included in each of the plurality of clusters from among the plurality of SEM images and the primary optimization parameters.
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2.发明授权公开(公告)号：US11678390B2
公开(公告)日：2023-06-13
申请号：US17151779
申请日：2021-01-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongho Ahn , Sungnam Kang , Jungyouel Bang , Sunyoung Song
CPC classification number: H04W76/14 , H04W4/80 , H04W8/005 , H04W52/243
Abstract: In accordance with certain embodiments of the disclosure, an electronic device comprises a communication circuitry configured to transmit or receive a first wireless communication signal to an external device in a first communication scheme; a memory; and a processor, wherein the processor is configured to: scan for a second wireless communication signal by a second communication scheme proximate to the electronic device; operate in a first mode of controlling a transmission power of the first wireless communication signal based on receive sensitivity for the first wireless communication signal of the external device, when the second wireless communication signal is determined to interfere less than an interference level with the first communication scheme; and operate in a second mode of transmitting the first wireless communication signal at a higher transmission power than the first mode, when the second wireless communication signal is determined to interfere in excess of the interference level with the first communication scheme.
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公开(公告)号：US20240272089A1
公开(公告)日：2024-08-15
申请号：US18411816
申请日：2024-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minsu Kim , Seungryeol Oh , Jeongho Ahn
IPC: G01N21/956 , G01N21/25 , G01N21/55 , G01N21/88
CPC classification number: G01N21/956 , G01N21/255 , G01N2021/555 , G01N2021/8835 , G01N2201/068 , G01N2201/127
Abstract: A defect inspection device includes a stage on which a substrate is provided, an objective lens disposed above the stage to project light onto the substrate, a light source configured to emit light onto a main surface of the substrate via the objective lens, a light quantity measurement sensor disposed above the stage and configured to measure an amount of the light that is reflected from a first region of the main surface of the substrate, a light quantity regulator located between the light source and the objective lens and configured to regulate an amount of the light that is emitted from the light source onto the main surface of the substrate.
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公开(公告)号：US12130242B2
公开(公告)日：2024-10-29
申请号：US18446837
申请日：2023-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Yoon , Jeongho Ahn , Dongryul Lee , Dongchul Ihm , Chungsam Jun
IPC: G01N21/95 , G01N21/88 , G01N21/956 , H01L21/66
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , H01L22/12
Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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公开(公告)号：US11754510B2
公开(公告)日：2023-09-12
申请号：US17501318
申请日：2021-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Yoon , Jeongho Ahn , Dongryul Lee , Dongchul Ihm , Chungsam Jun
IPC: G01N21/95 , H01L21/66 , G01N21/88 , G01N21/956
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , H01L22/12
Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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Patent Agency Ranking
公开(公告)号：US20240192154A1
公开(公告)日：2024-06-13
申请号：US18243835
申请日：2023-09-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwangeun Kim , Sewon Kim , Huisoo Kim , Jeongho Ahn , Sungeun Lee
IPC: G01N23/2251
CPC classification number: G01N23/2251 , G01N2223/42 , G01N2223/6116
Abstract: A pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (SEM) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the SEM image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the SEM image.
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7.发明授权公开(公告)号：US10136286B2
公开(公告)日：2018-11-20
申请号：US15200332
申请日：2016-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bo-Ram Namgoong , Jeongho Ahn , Chulkwi Kim , Jin Sagong
Abstract: An electronic device and a method for controlling an external electronic device connected to the electronic device through wireless communication are provided herein. A first electronic device includes a communication module configured to communicate with a second electronic device; and a processor configured to, in response to an entry event of a communication restriction mode in which at least one communication function of the first electronic device is deactivated, provide entry information of the communication restriction mode and release information of the communication restriction mode to the second electronic device, and control performance of the communication restriction mode using the entry information and the release information.
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公开(公告)号：US10067067B2
公开(公告)日：2018-09-04
申请号：US15203317
申请日：2016-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongsil Lee , Jeongho Ahn
IPC: G01N21/88 , G01N21/47 , G01N21/956
Abstract: A substrate inspection apparatus may include a light source, which is configured to emit an incident light. The substrate inspection apparatus may further include a support, a detector, and a light adjuster. The supporting base configured to support a substrate, the detector configured to detect a defect on the substrate, and the light adjuster configured to allow the incident light to be reflected. The detector may be configured to collect a scattering signal. The scattering signal is generated from an optical interaction between an evanescent wave and the defect on the substrate, and to detect the defect. The evanescent wave may be generated when the incident light is totally and/or substantially reflected by the light adjuster.
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公开(公告)号：US20250027875A1
公开(公告)日：2025-01-23
申请号：US18775796
申请日：2024-07-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinwoo Lee , Seungryeol Oh , Hidong Kwak , Jeongho Ahn , Seongsil Lee , Suyoung Lee , Hyeongcheol Lee
IPC: G01N21/31
Abstract: An optical imaging device includes a pulse generator including a pulse generating device configured to generate pulse lasers and a pulse expander configured to receive a pulse laser from the pulse generating device, and generate a broadened pulse laser by expanding a spectrum and width of the received pulse laser, an optical assembly including an objective lens configured to receive the broadened pulse laser and pass the received broadened pulse laser to a target object, and a light receiver including a light receiving device configured to receive a reflected pulse laser corresponding to the broadened pulse laser reflected from the target object and convert the reflected pulse laser into an electrical signal, and at least one processor configured to generate a spectral image set based on the electrical signal generated by the light receiving device.
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公开(公告)号：US20240077424A1
公开(公告)日：2024-03-07
申请号：US18222608
申请日：2023-07-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunwoo RYOO , Seulji Song , Minji Jeon , Hidong Kwak , Jeongho Ahn
CPC classification number: G01N21/65 , G01J3/0216 , G01J3/4412
Abstract: A semiconductor-device inspection apparatus includes a stage configured to allow a measurement target to be placed thereon, an actuator configured to move the stage in a vertical direction, a detector configured to detect a plurality of Raman spectra from scattered light that has been scattered away from the measurement target, and a processor configured to generate a plurality of spectral images for a measurement variable by using the plurality of Raman spectra detected by the detector, wherein the detector is further configured to detect the plurality of Raman spectra at different vertical levels of the measurement target.
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