公开(公告)号：US20240377760A1

公开(公告)日：2024-11-14

申请号：US18505041

申请日：2023-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoong HWANG ,  Yongsuk CHOI ,  Yonghoon HWANG ,  Kyung-Won KANG ,  Dong-Wook KIM ,  Seok HEO

IPC: G03F7/00

Abstract: A photolithography apparatus according to an embodiment includes an exposure portion performing an exposure process, a plurality of track portions each performing a coating process and a developing process, and an interface portion connecting the exposure portion and the plurality of track portions to transfer a substrate on which a photolithography process is performed between the exposure portion and the plurality of track portions.

公开(公告)号：US20240248418A1

公开(公告)日：2024-07-25

申请号：US18434948

申请日：2024-02-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok HEO ,  Cha Won KOH ,  Sang Joon HONG ,  Hyun Woo KIM ,  Kyung-Won KANG ,  Dong-Wook KIM ,  Kyung Won SEO ,  Young Il JANG ,  Yong Suk CHOI

IPC: G03F7/00 ,  G03F7/16 ,  H01L21/677 ,  H01L21/687

CPC classification number: G03F7/70875 ,  G03F7/168 ,  G03F7/70033 ,  H01L21/67703 ,  H01L21/68707

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

公开(公告)号：US20230170232A1

公开(公告)日：2023-06-01

申请号：US18101709

申请日：2023-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Kyung-Won KANG ,  Hyeon Jun KANG ,  Ju Bong LEE ,  Sung Hun JANG ,  Seok HEO ,  Hyun Woong HWANG

IPC: H01L21/67 ,  B05B12/12 ,  H01L21/68

CPC classification number: H01L21/67259 ,  B05B12/124 ,  H01L21/681 ,  H01L21/6715 ,  B25J11/0075

Abstract: A manufacturing apparatus for a semiconductor device, the manufacturing apparatus including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical toward the wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is rotating; and a controller configured to control a position of the nozzle by using the displacement variation while the spin chuck is rotating.

公开(公告)号：US20200086454A1

公开(公告)日：2020-03-19

申请号：US16379186

申请日：2019-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hui-Gwan LEE ,  Hyun-Joong KIM ,  Tae-Min EARMME ,  Kyung-Won KANG ,  Jong-Hwi SEO

IPC: B24B37/26 ,  B24B37/34

Abstract: A polishing head includes a carrier body detachably fixed to a drive shaft and having a plurality of first fluid passages penetrating therethrough to extend from an upper surface to a lower surface of the carrier body, upper end portions of the first fluid passages being arranged to be spaced apart from each other in a circumferential direction about a central axis thereof, a flexible membrane clamped to a lower portion of the carrier body to form a plurality of pressurizing chambers, wherein at least one of the pressurizing chambers is divided into a plurality of sub-chambers arranged in a circumferential direction about a central axis of the flexible membrane, the sub-chambers being in fluid communication with lower end portions of the first fluid passages respectively, and a fluid sealing part on the carrier body to support the carrier body to be rotatable and flow a fluid into each of the first fluid passages in a sealed state.