公开(公告)号：US20240096960A1

公开(公告)日：2024-03-21

申请号：US18239248

申请日：2023-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghyun SONG ,  Minsuk Kim ,  Pilkwang Kim ,  Takeshi Okagaki ,  Geunmyeong Kim ,  Ahyoung kim ,  Yoonsuk Kim

IPC: H01L29/08 ,  H01L23/528 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/0847 ,  H01L23/5286 ,  H01L27/092 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78696

Abstract: An integrated circuit device includes a back side interconnection structure extending in a first horizontal direction. An active substrate includes a fin-type active area extending in the first horizontal direction on the back side interconnection structure. A metal silicide film is between the back side interconnection structure and the active substrate. A plurality of gate structures extends in a second horizontal direction perpendicular to the first horizontal direction on the active substrate. A first source/drain area and a second source/drain area are spaced apart from each other in the first horizontal direction with the plurality of gate structures therebetween on the active substrate. The first source/drain area directly contacts the active substrate. The second source/drain area is spaced apart from the active substrate and insulated from the active substrate.

公开(公告)号：US10439268B2

公开(公告)日：2019-10-08

申请号：US15185171

申请日：2016-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gunhee Son ,  Minsuk Kim ,  Soon-Sang Park

IPC: H01Q1/24 ,  H01Q1/48 ,  H04B1/3827 ,  H01Q7/00 ,  H01Q21/28 ,  H01Q5/328 ,  H01Q5/335 ,  H01Q5/364

Abstract: One embodiment disclosed in the present disclosure may provide an antenna device that includes: a metal member that forms at least a part of an external housing for the electronic device; a printed circuit board (PCB) coupled to a feed connector of the metal member, such that the metal member is configured to operate as an antenna radiator for the PCB; and the metal member further including at least two grounding connectors that are coupled to ground through the PCB, wherein the feed connector and the two grounding connectors are located at different positions on the metal member, and may provide an electronic device that includes the same. Accordingly, it is possible to easily design an antenna that operates in a desired frequency band, to reduce the cost, to make the exterior of the device appealing due to the advantage of design, and to maximize the efficient use of space for the design of a multiband antenna.

公开(公告)号：US20150048449A1

公开(公告)日：2015-02-19

申请号：US14321018

申请日：2014-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changki Jeon ,  Minsuk Kim ,  Jeongho Kim ,  Yongcheol Choi

IPC: H01L29/78

CPC classification number: H01L29/7816 ,  H01L27/0629 ,  H01L27/0922 ,  H01L29/0619 ,  H01L29/063 ,  H01L29/0878 ,  H01L29/0886 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/42368 ,  H01L29/66681 ,  H01L29/7817

Abstract: A high voltage semiconductor device includes a semiconductor substrate having a first conductivity type and including a low voltage part and a high voltage part, a semiconductor layer having a second conductivity type on the semiconductor substrate, a body region having the first conductivity type on the semiconductor layer, a first buried layer having the second conductivity type between the high voltage part of the semiconductor substrate and the semiconductor layer, and a second buried layer having the first conductivity type and having sidewalls inside sidewalls of the first buried layer and extending deeper into the substrate than the first buried layer. A surface of the body region adjacent the substrate is spaced apart from a surface of the second buried layer remote from the substrate such that a portion of the semiconductor layer is disposed therebetween.

Abstract translation: 高电压半导体器件包括具有第一导电类型并包括低电压部分和高电压部分的半导体衬底，半导体衬底上具有第二导电类型的半导体层，半导体上具有第一导电类型的体区 在半导体衬底的高电压部分和半导体层之间具有第二导电类型的第一掩埋层和具有第一导电类型的第二掩埋层，并且在第一掩埋层的侧壁内侧延伸并延伸到 衬底比第一掩埋层。 与衬底相邻的本体区域的表面与远离衬底的第二掩埋层的表面间隔开，使得半导体层的一部分位于它们之间。