公开(公告)号：US20130175554A1

公开(公告)日：2013-07-11

申请号：US13737280

申请日：2013-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho HAN ,  Jin Ha KIM ,  Chin Woo KIM ,  Sung Ho JEON ,  Seok Man CHO

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/13 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0041 ,  H01L2933/005 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00

Abstract: There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval.

Abstract translation: 提供了一种发光二极管（LED）封装基板，包括：基板，包括可安装多个LED芯片的芯片安装区域; 导电层，包括设置在芯片安装区域上的多个电极图案; 以及形成坝的槽部，其中，所述槽部围绕所述芯片安装区域，并且与所述芯片安装区域间隔开预定间隔。