公开(公告)号：US20140117391A1

公开(公告)日：2014-05-01

申请号：US13937865

申请日：2013-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Woo HA ,  Chin Woo KIM ,  Jin Ha KIM

IPC: F21V13/04 ,  H01L33/60

CPC classification number: H01L33/60 ,  G02B19/0061 ,  H01L33/58

Abstract: An LED lens includes a recess disposed in a quadrangular bottom surface of the LED lens and configured to have a light source disposed therein, wherein an internal surface of the recess, including lateral surfaces and top surfaces, is a light incident surface. The LED lens further includes a top surface forming a light exit surface, having a size greater than that of the bottom surface, and having a quadrangular shape; and lateral surfaces of the LED lens, disposed between the top and bottom surfaces of the LED lens, forming a reflective surface, and guiding light incident to the LED lens through the light incident surface to the light exit surface. The top surfaces of the light incident surface form an inverted quadrangular pyramid.

Abstract translation: LED透镜包括设置在LED透镜的四边形底表面中并且被配置为具有设置在其中的光源的凹部，其中包括侧表面和顶表面的凹部的内表面是光入射表面。 LED透镜还包括形成光出射表面的顶表面，其尺寸大于底表面的尺寸，并且具有四边形形状; 以及设置在LED透镜的顶表面和底表面之间的LED透镜的侧表面，形成反射表面，并且将通过光入射表面入射到LED透镜的光引导到光出射表面。 光入射表面的顶面形成倒四角锥。

公开(公告)号：US20130175554A1

公开(公告)日：2013-07-11

申请号：US13737280

申请日：2013-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho HAN ,  Jin Ha KIM ,  Chin Woo KIM ,  Sung Ho JEON ,  Seok Man CHO

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/13 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0041 ,  H01L2933/005 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00

Abstract: There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval.

Abstract translation: 提供了一种发光二极管（LED）封装基板，包括：基板，包括可安装多个LED芯片的芯片安装区域; 导电层，包括设置在芯片安装区域上的多个电极图案; 以及形成坝的槽部，其中，所述槽部围绕所述芯片安装区域，并且与所述芯片安装区域间隔开预定间隔。

公开(公告)号：US20140203315A1

公开(公告)日：2014-07-24

申请号：US14056339

申请日：2013-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chin Woo KIM ,  Jin Ha KIM ,  Sang Woo HA

IPC: F21K99/00 ,  H01L33/58

CPC classification number: H01L33/58 ,  F21V5/04 ,  F21V7/0091 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting diode (LED) lens comprises a light incident surface on a bottom surface of the LED lens facing a light source. A light exit surface, having a size greater than the bottom surface, is defined by a top surface of the LED lens. A planar portion, emitting light incident through the light incident surface, is in a central region of the light exit surface. At least one protrusion portion, protruding to be stepped with respect to the planar portion, is in a region of the light exit surface except for the central region. A reflective surface, defined by lateral surfaces of the LED lens between the top surface of the LED lens and the bottom surface thereof, guides the light incident through the light incident surface, and contacts a lower portion of the light exit surface corresponding to a boundary between the protrusion and the planar portions.

Abstract translation: 发光二极管（LED）透镜包括在面向光源的LED透镜的底表面上的光入射表面。 具有大于底表面的尺寸的光出射表面由LED透镜的顶表面限定。 发射通过光入射表面入射的光的平面部分在光出射表面的中心区域中。 相对于平面部分突出成阶梯状的至少一个突出部分位于除了中心区域之外的光出射表面的区域中。 在LED透镜的顶表面和其底表面之间由LED透镜的侧表面限定的反射表面引导入射穿过光入射表面的光，并且接触与边界对应的光出射表面的下部 在突起和平面部分之间。