公开(公告)号：US20180265819A1

公开(公告)日：2018-09-20

申请号：US15984050

申请日：2018-05-18

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Dongwoo Fine-Chem Co., Ltd.

Inventor： In-goo KANG ,  Sung-bae KIM ,  Baik-soon CHOI ,  Sue-ryeon KIM ,  Young-taek HONG ,  Sang-tae KIM ,  Kyong-ho LEE ,  Hyung-pyo HONG ,  Seong-min KIM

IPC: C11D7/50 ,  C11D7/32 ,  C09J183/04 ,  B32B43/00 ,  H01L21/683 ,  H01L21/02

CPC classification number: C11D7/5013 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  C09J183/04 ,  C11D7/267 ,  C11D7/3209 ,  C11D7/3281 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/6835 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Disclosed herein are compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins. More particularly, disclosed herein are compositions for removing silicone resins, the compositions including a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.

公开(公告)号：US20170158888A1

公开(公告)日：2017-06-08

申请号：US15369859

申请日：2016-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-goo KANG ,  Sung-bae KIM ,  Baik-soon CHOI ,  Sue-ryeon KIM ,  Young-taek HONG ,  Sang-tae KIM ,  Kyong-ho LEE ,  Hyung-pyo HONG ,  Seong-min KIM

IPC: C09D9/00 ,  B32B37/00 ,  B32B43/00 ,  H01L21/683 ,  C09J183/04

CPC classification number: C09D9/005 ,  B32B37/0046 ,  B32B43/006 ,  B32B2383/00 ,  B32B2457/14 ,  C09D9/04 ,  C09J183/04 ,  H01L21/31111 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/00 ,  H01L25/0657 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Disclosed herein are compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins. More particularly, disclosed herein are compositions for removing silicone resins, the compositions including a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.