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公开(公告)号：US20230231026A1
公开(公告)日：2023-07-20
申请号：US17890547
申请日：2022-08-18
发明人： Seungkyu KIM , Yonghee PARK , Dong-Gwan SHIN , Dae Sin KIM , Sangyong KIM , Joohyung YOU
IPC分类号： H01L29/423 , H01L29/66 , H01L29/786 , H01L29/08
CPC分类号： H01L29/42392 , H01L29/6656 , H01L29/78696 , H01L29/0847
摘要： A semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern and including semiconductor patterns vertically stacked and spaced apart from each other, a source/drain pattern connected to the semiconductor patterns, a gate electrode on the semiconductor patterns and extending in a first direction, and a gate insulating layer between the semiconductor patterns and the gate electrode. A first semiconductor pattern of the semiconductor patterns includes opposite side surfaces in the first direction, and bottom and top surfaces. The gate insulating layer covers the opposite side surfaces, and the bottom and top surfaces and includes a first region on one of the opposite side surfaces of the first semiconductor pattern and a second region on one of the top or bottom surfaces of the first semiconductor pattern, and a thickness of the first region may be greater than a thickness of the second region.
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公开(公告)号：US20240113182A1
公开(公告)日：2024-04-04
申请号：US18538575
申请日：2023-12-13
发明人： Yonghee PARK , Myunggil KANG , Uihui KWON , Seungkyu KIM , Ahyoung KIM , Ahyoung KIM , Youngseok SONG
IPC分类号： H01L29/417 , H01L27/088 , H01L29/06 , H01L29/423 , H01L29/786
CPC分类号： H01L29/41775 , H01L27/088 , H01L29/0665 , H01L29/42392 , H01L29/78696
摘要： An integrated circuit device includes a fin-type active region disposed on a substrate and extending in a first horizontal direction, a gate line disposed on the fin-type active region and extending in a second horizontal direction intersecting the first horizontal direction, the gate line including, a connection protrusion portion including a protrusion top surface at a first vertical level from the substrate, and a main gate portion including a recess top surface extending in the second horizontal direction from the connection protrusion portion, the recess top surface being at a second vertical level lower than the first vertical level, a gate contact disposed on the gate line and connected to the connection protrusion portion, a source/drain region disposed on the fin-type active region and disposed adjacent to the gate line, and a source/drain contact disposed on the source/drain region.
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公开(公告)号：US20220165857A1
公开(公告)日：2022-05-26
申请号：US17352973
申请日：2021-06-21
发明人： Yonghee PARK , Myunggil KANG , Uihui KWON , Seungkyu KIM , Ahyoung KIM , Youngseok SONG
IPC分类号： H01L29/417 , H01L29/06 , H01L29/423 , H01L29/786 , H01L27/088
摘要： An integrated circuit device includes a fin-type active region disposed on a substrate and extending in a first horizontal direction, a gate line disposed on the fin-type active region and extending in a second horizontal direction intersecting the first horizontal direction, the gate line including, a connection protrusion portion including a protrusion top surface at a first vertical level from the substrate, and a main gate portion including a recess top surface extending in the second horizontal direction from the connection protrusion portion, the recess top surface being at a second vertical level lower than the first vertical level, a gate contact disposed on the gate line and connected to the connection protrusion portion, a source/drain region disposed on the fin-type active region and disposed adjacent to the gate line, and a source/drain contact disposed on the source/drain region.
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公开(公告)号：US20170244149A1
公开(公告)日：2017-08-24
申请号：US15433343
申请日：2017-02-15
发明人： Seungkyu KIM , Hyunjong OH , Chulhyung YANG , Jiwoo LEE
摘要： An electronic device is provided, including a housing, a side member, a display, a printed circuit board (PCB), and a communication device. The housing includes a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, forming a space between the first and second plates. The side member surrounds at least part of the space. The communication device is disposed in the housing and connected with the PCB. The side member includes a first antenna unit disposed on one side of the electronic device, electrically connected with a radio frequency (RF) module, and having a first metal frame. The housing further includes a board-type antenna which includes a second antenna unit electrically connected with a WiFi module, an antenna connector configured to electrically connect the first and second antenna units, and a third antenna unit electrically connected with the antenna connector.
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