公开(公告)号：US11029256B2

公开(公告)日：2021-06-08

申请号：US16846978

申请日：2020-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Heung Ahn ,  Racine Nassau ,  Su Hwan Park ,  Ki Wan Seo ,  Nam Il Koo ,  In Keun Baek ,  Jong Min Yoon ,  Ik Seon Jeon

IPC: G01N21/95

Abstract: Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.

公开(公告)号：US20190079003A1

公开(公告)日：2019-03-14

申请号：US15981359

申请日：2018-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Heung Ahn ,  Young Duk Kim ,  Sang Gil Park ,  Jun Bum Park ,  Yoichiro Iwa ,  Byeong Hwan Jeon

IPC: G01N21/01 ,  G01N21/17 ,  H01L21/67 ,  G01N21/94 ,  G01N15/14

Abstract: An inspection apparatus includes a light source. A first measurement unit is configured to receive light from the light source and direct it to a first measurement object. A second measurement unit is configured to receive the light from the light source and direct it to a second measurement object. An inspection unit is configured to receive a first optical signal provided from the first measurement unit and inspect the first measurement object using the first optical signal, and to receive a second optical signal provided from the second measurement unit and inspect the second measurement object using the second optical signal. A measurement position selection unit is configured to alternately enable the inspection of the two measurement units by adjusting an angle of a reflection mirror.

公开(公告)号：US10473579B2

公开(公告)日：2019-11-12

申请号：US15981359

申请日：2018-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae-Heung Ahn ,  Young Duk Kim ,  Sang Gil Park ,  Jun Bum Park ,  Yoichiro Iwa ,  Byeong Hwan Jeon

IPC: G01N21/01 ,  G01N21/17 ,  H01L21/67 ,  G01N21/94 ,  G01N15/14 ,  G01N21/88 ,  G01N21/95 ,  G01N21/84

Abstract: An inspection apparatus includes a light source. A first measurement unit is configured to receive light from the light source and direct it to a first measurement object. A second measurement unit is configured to receive the light from the light source and direct it to a second measurement object. An inspection unit is configured to receive a first optical signal provided from the first measurement unit and inspect the first measurement object using the first optical signal, and to receive a second optical signal provided from the second measurement unit and inspect the second measurement object using the second optical signal. A measurement position selection unit is configured to alternately enable the inspection of the two measurement units by adjusting an angle of a reflection mirror.