METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE 有权
    形成半导体器件图案的方法

    公开(公告)号:US20160005615A1

    公开(公告)日:2016-01-07

    申请号:US14705969

    申请日:2015-05-07

    CPC classification number: H01L21/3086 H01L21/0337 H01L21/3081 H01L21/76816

    Abstract: A method of forming patterns of a semiconductor device includes forming a material film on a substrate, forming a hard mask on the material film, forming a first mold mask pattern and a second mold mask pattern on the hard mask, forming a pair of first spacers to cover opposite sidewalls of the first mold mask pattern, and a pair of second spacers to cover opposite sidewalls of the second mold mask pattern, forming a first gap and a second gap to expose the hard mask by removing the first mold mask pattern and the second mold mask pattern, the first gap being formed between the pair of first spacers and the second gap being formed between the pair of second spacers, forming a mask pattern on the hard mask to cover the first gap and expose the second gap, forming an auxiliary pattern to cover the second gap, removing the mask pattern; and forming a hard mask pattern by patterning the hard mask using the first spacers, the second spacers and the auxiliary pattern as a mask.

    Abstract translation: 一种形成半导体器件的图案的方法包括:在基片上形成材料膜,在所述材料膜上形成硬掩模,在所述硬掩模上形成第一模具掩模图案和第二模具掩模图案,形成一对第一间隔物 以覆盖第一模具掩模图案的相对侧壁,以及一对第二间隔件,以覆盖第二模具掩模图案的相对的侧壁,形成第一间隙和第二间隙以通过去除第一模具掩模图案以暴露硬掩模,并且 第二模具掩模图案,所述第一间隙形成在所述一对第一间隔件和所述第二间隙之间,形成在所述一对第二间隔件之间,在所述硬掩模上形成掩模图案以覆盖所述第一间隙并暴露所述第二间隙, 辅助图案覆盖第二间隙,去除掩模图案; 以及通过使用第一间隔物,第二间隔物和辅助图案作为掩模来图案化硬掩模来形成硬掩模图案。

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