公开(公告)号：US09825014B2

公开(公告)日：2017-11-21

申请号：US15226209

申请日：2016-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo Cha ,  Yong Ii Kim ,  Wan tae Lim

IPC: H01L33/60 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H05K1/00 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.