METHOD AND APPARATUS FOR OFFLOADING DATA TRAFFIC IN A WIRELESS COMMUNICATION SYSTEM
    3.
    发明申请
    METHOD AND APPARATUS FOR OFFLOADING DATA TRAFFIC IN A WIRELESS COMMUNICATION SYSTEM 有权
    用于在无线通信系统中卸载数据业务的方法和装置

    公开(公告)号:US20150003314A1

    公开(公告)日:2015-01-01

    申请号:US14318434

    申请日:2014-06-27

    CPC classification number: H04W68/02 H04W28/08 H04W76/00

    Abstract: Provided is a method for offloading data traffic by a Mobility Management Entity (MME) in a wireless communication system. The method includes determining a Packet Data Network (PDN) to connect to for providing a service requested by a User Equipment (UE), upon receiving a connection request message requesting connection between the UE and the PDN from the UE, selecting a gateway disposed closest to a Radio Access Network (RAN), sending a permit message permitting a request for connection between the UE and the PDN to the UE, and setting an Evolved Packet Service (EPS) bearer for transmission and reception of data traffic related to a service requested by the UE between the UE and the gateway.

    Abstract translation: 提供了一种用于在无线通信系统中由移动性管理实体(MME)卸载数据业务的方法。 该方法包括:在接收到请求UE与UE之间的连接的连接请求消息时,确定要连接的分组数据网络(PDN)以提供由用户设备(UE)请求的服务,选择最靠近的网关 向无线电接入网络(RAN)发送许可消息,允许在UE和PDN之间连接到UE的请求,并且设置演进分组业务(EPS)承载以发送和接收与所请求的业务相关的数据业务 由UE在UE和网关之间。

    Semiconductor device and method of manufacturing the same

    公开(公告)号:US10854614B2

    公开(公告)日:2020-12-01

    申请号:US16203692

    申请日:2018-11-29

    Abstract: Disclosed are semiconductor devices and methods of manufacturing the same. A support layer and a mold layer are partially etched off from the substrate, to form a mold pattern and a support pattern on the substrate such that a contact hole is formed through the support pattern and the mold pattern and an interconnector is exposed therethrough. A lower electrode layer is formed on the mask pattern to fill the contact hole, and a lower electrode is formed in the contact hole by partially removing the lower electrode layer and the mask pattern. The lower electrode is contact with the interconnector and is supported by the support pattern having the same thickness as the support layer.

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