公开(公告)号：US10473894B2

公开(公告)日：2019-11-12

申请号：US15340194

申请日：2016-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Heu ,  Jung-Pa Seo ,  Hyun-Jea Kim ,  Yong-Jae Lee ,  Hwan-Seon Lee

IPC: G02B13/00 ,  G02B9/62 ,  G02B27/00

Abstract: An optical system may include: a first lens having positive refractive power facing an object, the first lens having a first convex face facing the object; a second lens having positive refractive power, the second lens having a second convex face facing the object; a third lens having negative refractive power, the third lens having a third concave face facing an image sensor; a fourth lens adjacent to the third lens; a fifth lens adjacent to the fourth lens, the fifth lens having a fourth face facing the object, the fourth face being convex where the fifth lens intersects the optical axis; and a sixth lens adjacent to the fifth lens. The characteristics of the optical system satisfy equation, 0.4

公开(公告)号：US20150091133A1

公开(公告)日：2015-04-02

申请号：US14315770

申请日：2014-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-Ho Cho ,  Hyun-Jeong Yang ,  Se-Hoon Oh ,  Yong-Jae Lee ,  Ki-Vin IM ,  Jae-Soon Lim ,  Han-Jin Lim ,  Jae-Wan Chang ,  Chang-Hwa Jung

IPC: H01L49/02

CPC classification number: H01L28/75 ,  H01L27/10855 ,  H01L28/65 ,  H01L28/91

Abstract: In a semiconductor device and in methods of formation thereof, a semiconductor device comprises a substrate, a lower electrode on the substrate, and a dielectric layer on the lower electrode. An adhesion layer is positioned on the dielectric layer and an upper electrode is positioned on the adhesion layer. The adhesion layer contacts the dielectric layer and the upper electrode, and comprises a conductive material.

Abstract translation: 在半导体器件及其形成方法中，半导体器件包括衬底，衬底上的下电极和下电极上的电介质层。 粘合层位于介电层上，上电极位于粘合层上。 粘合层接触电介质层和上电极，并且包括导电材料。