公开(公告)号：US20220336241A1

公开(公告)日：2022-10-20

申请号：US17543025

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Ji Hun Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  Youn Gon Oh ,  Byung Kook Yoo ,  Hyun Woo Lee ,  Jeong Hun Lim

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

公开(公告)号：US11733077B2

公开(公告)日：2023-08-22

申请号：US17504212

申请日：2021-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanga Bang ,  Geunhyung Kim ,  Sangmin Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  JongJin Ahn ,  Min Kyun Lee ,  Sangkyung Lee ,  Kyubum Cho

IPC: G01F1/42 ,  G01F1/37

CPC classification number: G01F1/42 ,  G01F1/37

Abstract: A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

公开(公告)号：US09543178B2

公开(公告)日：2017-01-10

申请号：US14602584

申请日：2015-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Woo Lee ,  Chang-Woo Son ,  Yong-Jun Ahn ,  Tai-Jo Jeon

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6773 ,  H01L21/67294 ,  H01L21/67373 ,  H01L21/67379 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

Abstract: A semiconductor wafer stocker apparatus includes a body frame, an inlet port to load a wafer shipping box into the body frame, an outlet port to unload the wafer shipping box from the body frame, an automated transfer robot operable to convey the wafer shipping box between the inlet port and the outlet port, and a shelf module within the body frame. The shelf module includes a shelf plate configured to support the wafer shipping box. The shelf plate includes first, second, and third protruding support pins arranged to align with respective grooves in an underside of the wafer shipping box and orient the wafer shipping box with a door thereof facing away from the body frame. The first and second support pins may be closer to the body frame than the third support pin. Related apparatus and methods of operation are also discussed.

Abstract translation: 半导体晶片储片器装置包括：主体框架，用于将晶片装运箱装载到主体框架中的入口端口，用于将晶片装运箱从主体框架卸载的出口;可操作以将晶片装运箱传送到 入口和出口，以及车体框架内的货架模块。 搁板模块包括构架成支撑晶片运输箱的搁板。 搁板包括第一，第二和第三突出支撑销，布置成与晶片运输箱的下侧中的相应凹槽对准，并且使晶片装运箱的门远离主体框架定向。 第一和第二支撑销可以比第三支撑销更靠近主体框架。 还讨论了相关装置和操作方法。

公开(公告)号：US20230406623A1

公开(公告)日：2023-12-21

申请号：US18163588

申请日：2023-02-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Seung Gyu Kang ,  Hyun Jae Kang ,  Sang Min Kim ,  Yong-Jun Ahn ,  Sang Kyung Lee ,  Hyun Woo Lee ,  Jeong Hun Lim ,  Jun Hyuk Chang

IPC: B65G1/04 ,  B65G47/90

CPC classification number: B65G1/0457 ,  B65G1/0464 ,  B65G47/905 ,  B65G49/07

Abstract: Provided is a ceiling storage system for increasing storage capacity by utilizing a ceiling space inside a fab. The ceiling storage system includes a first overhead rack including a plurality of storage positions for storing a plurality of articles; first and second support rails above the first overhead rack and extending in one direction; a first driving rail above the first overhead rack and in parallel with the first and second support rails; a second driving rail coupled to the first and second support rails and the first driving rail and moving along the first and second support rails and the first driving rail; and a first transport vehicle including a carriage coupled to the second driving rail and moving along the second driving rail, and a hoist and a hand unit installed on the carriage and for loading and unloading the articles to and from the first overhead rack.

公开(公告)号：US20160035607A1

公开(公告)日：2016-02-04

申请号：US14602584

申请日：2015-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Woo Lee ,  Chang-Woo Son ,  Yong-Jun Ahn ,  Tai-Jo Jeon

IPC: H01L21/677

CPC classification number: H01L21/6773 ,  H01L21/67294 ,  H01L21/67373 ,  H01L21/67379 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

Abstract: A semiconductor wafer stocker apparatus includes a body frame, an inlet port to load a wafer shipping box into the body frame, an outlet port to unload the wafer shipping box from the body frame, an automated transfer robot operable to convey the wafer shipping box between the inlet port and the outlet port, and a shelf module within the body frame. The shelf module includes a shelf plate configured to support the wafer shipping box. The shelf plate includes first, second, and third protruding support pins arranged to align with respective grooves in an underside of the wafer shipping box and orient the wafer shipping box with a door thereof facing away from the body frame. The first and second support pins may be closer to the body frame than the third support pin. Related apparatus and methods of operation are also discussed.

Abstract translation: 半导体晶片储片器装置包括：主体框架，用于将晶片装运箱装载到主体框架中的入口端口，用于将晶片装运箱从主体框架卸载的出口;可操作以将晶片装运箱传送到 入口和出口，以及车体框架内的货架模块。 搁板模块包括构架成支撑晶片运输箱的搁板。 搁板包括第一，第二和第三突出支撑销，布置成与晶片运输箱的下侧中的相应凹槽对准，并且使晶片装运箱的门远离主体框架定向。 第一和第二支撑销可以比第三支撑销更靠近主体框架。 还讨论了相关装置和操作方法。

公开(公告)号：US12283502B2

公开(公告)日：2025-04-22

申请号：US17543025

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Ji Hun Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  Youn Gon Oh ,  Byung Kook Yoo ,  Hyun Woo Lee ,  Jeong Hun Lim

IPC: G06F7/00 ,  H01L21/67 ,  H01L21/677

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

公开(公告)号：US10964570B2

公开(公告)日：2021-03-30

申请号：US16529082

申请日：2019-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyung Lee ,  Yong-Jun Ahn ,  Taijo Jeon ,  Kyubum Cho ,  Jongsam Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Junyong Lee

IPC: H01L21/673 ,  H01L21/67 ,  B05B1/30

Abstract: A semiconductor wafer storage system includes a container that provides a space in which a semiconductor wafer is to be stored, a fluid supply that provides a fluid to the container, a connection part that receives the fluid from the fluid supply and transfers the fluid to the container, and a nozzle part that connects the connection part to the container. The container may include a coupling plate to which the nozzle part is coupled, and the nozzle part may include a first nozzle and a second nozzle.

公开(公告)号：US20240383679A1

公开(公告)日：2024-11-21

申请号：US18391759

申请日：2023-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Seung Gyu Kang ,  Hyun Jae Kang ,  Sang Min Kim ,  Jae Sung Byun ,  Yong-Jun Ahn ,  Hyun Woo Lee ,  Jeong Hun Lim ,  Jun Hyuk Chang

IPC: B65G1/04 ,  B61B3/02

Abstract: A ceiling storage system includes a first support rail and a second support rail that extend in a first direction; a first driving rail that extends in the first direction and is parallel to the first support rail and the second support rail; a second driving rail movably coupled to the first support rail, the second support rail, and the first driving rail, where the second driving rail is configured to move along the first support rail, the second support rail, and the first driving rail; a transfer vehicle movably coupled to the second driving rail and configured to move along the second driving rail; and a connection device that connects the first driving rail and the second driving rail to each other, where the connection device and the second driving rail are rotatable around a first axis that is parallel to the first direction.

公开(公告)号：US12068185B2

公开(公告)日：2024-08-20

申请号：US17854681

申请日：2022-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Chul-Jun Park ,  Jae Sung Byun ,  Yong-Jun Ahn ,  Sang Kyung Lee ,  Hyun Woo Lee ,  Jeong Hun Lim ,  Jun Hyuk Chang ,  Kyu Bum Cho

IPC: H01L21/677 ,  B65G1/06

CPC classification number: H01L21/67712 ,  B65G1/06 ,  H01L21/67736 ,  B65G2201/0297

Abstract: An article transfer system includes a plurality of stage modules respectively provided at a plurality of layers, an interlayer transfer apparatus configured to transfer an article to each of the plurality of stage modules, and a plurality of loading and unloading apparatus respectively provided on each stage module of the plurality of stage modules, the plurality of loading and unloading apparatus configured to load an article onto respective stage modules of the plurality of stage modules. The interlayer transfer apparatus includes a mast frame extending so as to intersect each stage module of the plurality of stage modules, and a plurality of carriage units configured to move along a length direction of the mast frame, transfer articles, and move in a parallel manner with each other.

公开(公告)号：US20230099726A1

公开(公告)日：2023-03-30

申请号：US17854681

申请日：2022-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Chul-Jun Park ,  Jae Sung Byun ,  Yong-Jun Ahn ,  Sang Kyung Lee ,  Hyun Woo Lee ,  Jeong Hun Lim ,  Jun Hyuk Chang ,  Kyu Bum Cho

IPC: H01L21/677 ,  B65G1/06

Abstract: An article transfer system includes a plurality of stage modules respectively provided at a plurality of layers, an interlayer transfer apparatus configured to transfer an article to each of the plurality of stage modules, and a plurality of loading and unloading apparatus respectively provided on each stage module of the plurality of stage modules, the plurality of loading and unloading apparatus configured to load an article onto respective stage modules of the plurality of stage modules. The interlayer transfer apparatus includes a mast frame extending so as to intersect each stage module of the plurality of stage modules, and a plurality of carriage units configured to move along a length direction of the mast frame, transfer articles, and move in a parallel manner with each other.