公开(公告)号：US09911706B2

公开(公告)日：2018-03-06

申请号：US14789247

申请日：2015-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-hyun Cho ,  Jun-phyo Lee ,  Yong-hwan Jeong

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/66

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05553 ,  H01L2224/05557 ,  H01L2224/05576 ,  H01L2224/05616 ,  H01L2224/0562 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0603 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/48229 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/00012

Abstract: A semiconductor device includes a main pad part and a sub pad part formed in a peripheral area of at least one side of the main pad part. The sub pad part is spaced apart from the main pad part. The sub pad part operates in a first state in which the sub pad part is short-circuited with the main pad part or in a second state in which the sub pad part is open from the main pad part.