公开(公告)号：US12087748B2

公开(公告)日：2024-09-10

申请号：US17523635

申请日：2021-11-10

申请人： Samsung Display Co., LTD.

发明人： Jong Hwan Cha

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L27/12 ,  H01L33/42

CPC分类号： H01L25/167 ,  H01L24/03 ,  H01L24/05 ,  H01L27/1259 ,  H01L33/42 ,  H01L2224/03622 ,  H01L2224/05018 ,  H01L2224/05076 ,  H01L2224/05084 ,  H01L2224/05166 ,  H01L2224/05186 ,  H01L2224/05558 ,  H01L2224/05573 ,  H01L2224/05686 ,  H01L2933/0016

摘要： A display device having a pad area and a display area is provided. The display device includes: a substrate; a pad structure on the substrate in the pad area; and a display element part on the substrate in the display area. The pad structure includes a first pad pattern, a second pad pattern on the first pad pattern, and a third pad pattern on the second pad pattern, and the display element part includes a light emitting element configured to emit light in a display direction. The second pad pattern has a first area and a second area, the second pad pattern and the third pad pattern do not contact each other in the first area, and the second pad pattern and the third pad pattern contact each other in the second area.

公开(公告)号：US20240243028A1

公开(公告)日：2024-07-18

申请号：US18534753

申请日：2023-12-11

申请人： Innolux Corporation

发明人： Ming-Chih Tsai ,  Chen-Yu Lin

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/3192 ,  H01L21/56 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/05166 ,  H01L2224/05179 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05547 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05679 ,  H01L2224/0568 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2924/0549

摘要： An electronic device includes a substrate, a metal composite structure, a first insulating layer, and a second insulating layer. The metal composite structure is disposed on the substrate and includes a first metal layer. The first metal layer has a first opening. The first insulating layer is disposed on the metal composite structure and has a second opening. The second insulating layer is disposed on the first insulating layer and has a third opening. In a cross section of the electronic device, the first opening has a first distance, the second opening has a second distance, and the third opening has a third distance. The second distance is greater than the third distance, and the third distance is greater than the first distance.

公开(公告)号：US20240178095A1

公开(公告)日：2024-05-30

申请号：US18167081

申请日：2023-02-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wensen Hung ,  Tsung-Yu Chen ,  Meng-Tsan Lee

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/373 ,  H01L25/065 ,  H10B80/00

CPC分类号： H01L23/3675 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/32 ,  H01L25/0655 ,  H10B80/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/33 ,  H01L24/73 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03622 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/1431 ,  H01L2924/1432

摘要： A semiconductor device includes a substrate, a first device, a second device, a ring structure, a lid structure, and a first adhesive layer. The first device is disposed on the substrate. The second device is adjacent to the first device and is disposed on the substrate. The ring structure is disposed over the substrate and the second device. The ring structure includes a cover and a leg extending out from the cover. The cover has a through opening. The lid structure is disposed over the ring structure and the first device. The lid structure includes a body and a protrusion protruding from the body. The protrusion of the lid structure is inserted into the through opening of the cover of the ring structure. The first adhesive layer is disposed between the body of the lid structure and the cover of the ring structure and includes phase change thermal interface material.

公开(公告)号：US20240162174A1

公开(公告)日：2024-05-16

申请号：US17986314

申请日：2022-11-14

申请人： NANYA TECHNOLOGY CORPORATION

发明人： TSE-YAO HUANG

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/0215 ,  H01L2224/02373 ,  H01L2224/03011 ,  H01L2224/04042 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/85

摘要： A semiconductor device includes an interconnect structure disposed over a semiconductor substrate. The interconnect structure includes a first interconnect portion and a second interconnect portion. The semiconductor device also includes a first porous dielectric portion disposed between the first interconnect portion and the second interconnect portion, and a dielectric layer surrounding the first porous dielectric portion. The semiconductor device further includes a bonding pad disposed over the dielectric layer and the first porous dielectric portion. The bonding pad and the first porous dielectric portion are separated by a first air gap.

公开(公告)号：US20230361072A1

公开(公告)日：2023-11-09

申请号：US18147212

申请日：2022-12-28

申请人： ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

发明人： Liang Wang ,  Rajesh Katkar ,  Javier A. DeLaCruz ,  Arkalgud R. Sitaram

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/532 ,  H01L23/528 ,  H01L23/10 ,  B81C1/00

CPC分类号： H01L24/29 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/528 ,  H01L23/10 ,  H01L24/08 ,  H01L24/06 ,  H01L24/05 ,  B81C1/00293 ,  B81C1/00269 ,  H01L2224/29019 ,  H01L2224/05571 ,  H01L2224/05686 ,  H01L24/80 ,  H01L2224/80896 ,  H01L2224/06165 ,  H01L2224/08121 ,  H01L2224/80047 ,  H01L2224/80948 ,  H01L23/562 ,  H01L2224/05551 ,  H01L2224/08237 ,  H01L2224/06505 ,  H01L2224/05555 ,  H01L2224/8001 ,  H01L2224/05552 ,  H05K1/111

摘要： A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.

公开(公告)号：US11756911B2

公开(公告)日：2023-09-12

申请号：US16438578

申请日：2019-06-12

申请人： International Business Machines Corporation

发明人： Krishna Tunga ,  Ekta Misra

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/05012 ,  H01L2224/05015 ,  H01L2224/05025 ,  H01L2224/05027 ,  H01L2224/0557 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05686 ,  H01L2224/10126 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/13014 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/13186 ,  H01L2224/81815 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2224/05144 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/13166 ,  H01L2924/00014 ,  H01L2224/05686 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/13186 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/13124 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/13113 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13139 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13116 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/056 ,  H01L2924/013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/013 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/056 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/01013 ,  H01L2924/00014

摘要： The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.

公开(公告)号：US20230275076A1

公开(公告)日：2023-08-31

申请号：US18312013

申请日：2023-05-04

申请人： CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.

发明人： Feng ZHAI

IPC分类号： H01L25/16 ,  H01L33/00 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L25/167 ,  H01L33/0093 ,  H01L24/05 ,  H01L24/95 ,  H01L22/22 ,  H01L24/06 ,  H01L24/08 ,  H01L24/03 ,  H01L24/80 ,  H01L2224/95001 ,  H01L2224/02175 ,  H01L2224/03013 ,  H01L2224/03318 ,  H01L2224/05073 ,  H01L2224/05022 ,  H01L2224/05578 ,  H01L2224/05609 ,  H01L2224/05686 ,  H01L2224/05562 ,  H01L2224/05571 ,  H01L2224/06505 ,  H01L2224/08502 ,  H01L2224/08123 ,  H01L2224/08145 ,  H01L2224/80203 ,  H01L2224/80805 ,  H01L2924/12041

摘要： A display backplane assembly, a light-emitting diode (LED) display module and a device, and related methods for manufacturing the same are provided in the disclosure. The display backplane assembly includes a display backplane and a planarization layer. The display backplane has a first surface, and electrode connecting pads are disposed on the first surface. The planarization layer is stacked on the first surface and defines multiple accommodating holes extending in a thickness direction of the planarization layer. The multiple accommodating holes correspond to the electrode connection pads. Each of the multiple accommodating holes includes a first hole and a second hole. A bonding material is filled in the first hole and in contact with the electrode connection pad. An adhesive is filled in the second hole.

公开(公告)号：US20230217748A1

公开(公告)日：2023-07-06

申请号：US17985477

申请日：2022-11-11

申请人： Samsung Display Co., Ltd.

发明人： MYONG-SOO OH

IPC分类号： H01L27/32 ,  H01L23/00

CPC分类号： H01L27/3276 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05573 ,  H01L2224/05686 ,  H01L2224/06051 ,  H01L2224/06155 ,  H01L2224/06515

摘要： A display device includes a display panel including a display area and a pad area. The display panel includes a base substrate, a pixel, a pad group, an alignment mark, and a protective layer. The pad group includes a plurality of pads arranged in a first direction. The alignment mark is spaced apart from the pad group in the first direction. The protective layer covers the pads and the alignment mark and a plurality of openings respectively exposing upper surfaces of the pads is defined in the protective layer. Each of the pads includes at least one pad pattern, and the alignment mark is disposed in a same layer as a pad pattern spaced farthest from the base substrate among the at least one pad pattern.

公开(公告)号：US20230215856A1

公开(公告)日：2023-07-06

申请号：US17991032

申请日：2022-11-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sihan KIM ,  Hankyu SEONG ,  Jihye YEON

IPC分类号： H01L25/18 ,  H01L27/15 ,  H01L23/00

CPC分类号： H01L25/18 ,  H01L24/05 ,  H01L24/08 ,  H01L27/156 ,  H01L24/80 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/08147 ,  H01L2224/80379 ,  H01L2224/80896 ,  H01L2924/059 ,  H01L2924/04953 ,  H01L2924/12041

摘要： A display apparatus includes: a circuit substrate; and a pixel array on the circuit substrate and including a plurality of pixels. The pixel array includes: light emitting diode (LED) cells constituting the plurality of pixels, each of the LED cells including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; wavelength converters on the LED cells; an upper semiconductor layer on the LED cells and having a partition structure; a passivation layer on side surfaces of the LED cells; a first electrode along a region of the LED cells to have a grid shape; second electrodes connected to the second conductivity-type semiconductor layers; and reflective layers between the first electrode and the second electrode along the passivation layer on the side surfaces of the LED cells and having surfaces inclined toward outside of the LED cells.

公开(公告)号：US20230154885A1

公开(公告)日：2023-05-18

申请号：US18049428

申请日：2022-10-25

申请人： Samsung Electronics Co., Ltd.

发明人： Jinyoung Kim ,  Jiyeong Kim ,  Okseon Yoon

IPC分类号： H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/295 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/18 ,  H01L25/50 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0567 ,  H01L2224/0568 ,  H01L2224/1317 ,  H01L2224/1318 ,  H01L2224/2929 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05617 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05649 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05663 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05681 ,  H01L2224/05683 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13117 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13149 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13183 ,  H01L2224/13184 ,  H01L2224/13186 ,  H01L2224/16146 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/73204

摘要： A semiconductor package includes a first semiconductor chip on a lower structure. A first underfill is between the first semiconductor chip and the lower structure. The first underfill includes a first portion adjacent to a center region of the first semiconductor chip, and a second portion adjacent to an edge region of the first semiconductor chip. The second portion has a higher degree of cure than the first portion. A plurality of inner connection terminals is between the first semiconductor chip and the lower structure. The plurality of inner connection terminals extends in the first underfill.