公开(公告)号：US20160049379A1

公开(公告)日：2016-02-18

申请号：US14640011

申请日：2015-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jik-Ho SONG ,  Ga-Young KIM ,  Woo-Jae KIM ,  Young-Hoon RO

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/563 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29194 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H05K1/00 ,  H05K3/28 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2203/0588 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/00012

Abstract: Embodiments of the inventive aspect include a printed circuit board and a semiconductor package using the same. The semiconductor package includes a substrate having one or more connection pads, semiconductor chips mounted on the substrate, an underfill layer filling a region between the semiconductor chips and the substrate, and solder bumps electrically connecting the connection pads and the semiconductor chips in the underfill layer. The substrate includes void preventing patterns protruding on a top surface of the substrate under the underfill layer.

Abstract translation: 本发明的实施例包括印刷电路板和使用其的半导体封装。 半导体封装包括具有一个或多个连接焊盘的衬底，安装在衬底上的半导体芯片，填充半导体芯片和衬底之间的区域的底部填充层，以及将连接焊盘和底部填充层中的半导体芯片电连接的焊料凸块 。 基板包括在底部填充层下方的基板的顶表面上突出的防止空白图案。