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公开(公告)号:US09837361B2
公开(公告)日:2017-12-05
申请号:US14874609
申请日:2015-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byoung-rim Seo , Woon-bae Kim , Young-doo Jung
IPC: H01L23/52 , H01L21/70 , H01L23/552 , H01L23/00 , H01L23/31 , H01L23/522 , H01L23/60 , H05K1/02
CPC classification number: H01L23/552 , H01L23/3114 , H01L23/3128 , H01L23/5225 , H01L23/60 , H01L24/02 , H01L24/05 , H01L24/13 , H01L2224/02372 , H01L2224/04105 , H01L2224/05025 , H01L2224/12105 , H01L2224/13024 , H01L2224/131 , H01L2224/13147 , H01L2224/80345 , H01L2224/96 , H01L2225/06537 , H01L2924/3025 , H05K1/0218 , H01L2224/03 , H01L2224/11 , H01L2924/014 , H01L2924/00014
Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.