公开(公告)号：US09837361B2

公开(公告)日：2017-12-05

申请号：US14874609

申请日：2015-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-rim Seo ,  Woon-bae Kim ,  Young-doo Jung

IPC: H01L23/52 ,  H01L21/70 ,  H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/60 ,  H05K1/02

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5225 ,  H01L23/60 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02372 ,  H01L2224/04105 ,  H01L2224/05025 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/80345 ,  H01L2224/96 ,  H01L2225/06537 ,  H01L2924/3025 ,  H05K1/0218 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.