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公开(公告)号:US10707234B2
公开(公告)日:2020-07-07
申请号:US16204637
申请日:2018-11-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hoon-Sung Choi , Dong-Il Park , Yuri Masuoka
IPC: H01L27/12 , H01L21/8234 , H01L21/84 , H01L27/092
Abstract: A semiconductor device comprises: a substrate; a first well region of a first conductivity type and a second well region of a second conductivity type formed horizontally adjacent to each other in the substrate; a buried insulation layer formed on the first well region and the second well region; a first semiconductor layer formed to vertically overlap the first well region, and a second semiconductor layer formed to vertically overlap the second well region, on the buried insulation layer; a first isolation layer formed between the first semiconductor layer and the second semiconductor layer on the buried insulation layer; and a conductive layer formed on the first semiconductor layer and the second semiconductor layer to extend over the first semiconductor layer and the second semiconductor layer.
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公开(公告)号:US11728429B2
公开(公告)日:2023-08-15
申请号:US17549985
申请日:2021-12-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yul Lee , Yuri Masuoka
IPC: H01L21/28 , H01L29/78 , H01L29/66 , H01L21/762 , H01L29/08
CPC classification number: H01L29/7848 , H01L21/28167 , H01L21/76264 , H01L29/0895 , H01L29/66621 , H01L29/66628 , H01L29/66636 , H01L29/66651 , H01L29/785 , H01L29/7833
Abstract: A semiconductor device includes at least one active pattern on a substrate, at least one gate electrode intersecting the at least one active pattern, source/drain regions on the at least one active pattern, the source/drain regions being on opposite sides of the at least one gate electrode, and a barrier layer between at least one of the source/drain regions and the at least one active pattern, the barrier layer being at least on bottoms of the source/drain regions and including oxygen.
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公开(公告)号:US11469228B2
公开(公告)日:2022-10-11
申请号:US17146938
申请日:2021-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanwook Lee , Seungkwon Kim , Jaechul Kim , Younggun Ko , Yuri Masuoka
IPC: H01L27/092 , H01L29/08 , H01L29/165 , H01L29/417 , H01L29/45 , H01L29/78 , H01L21/285 , H01L21/8238 , H01L29/66
Abstract: Disclosed is a semiconductor device comprising a substrate including PMOSFET and NMOSFET regions, first active fins at the PMOSFET region, second active fins at the NMOSFET region, a gate electrode extending in a first direction and running across the first and second active fins, a first source/drain pattern on the first active fins and connecting the first active fins to each other, a second source/drain pattern on the second active fins and connecting the second active fins to each other, a first active contact electrically connected to the first source/drain pattern, and a second active contact electrically connected to the second source/drain pattern. A maximum width of the first active contact in the first direction is less than a maximum width of the second active in the first direction.
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公开(公告)号:US10916476B2
公开(公告)日:2021-02-09
申请号:US16901484
申请日:2020-06-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Je-min Yoo , Sang-deok Kwon , Yuri Masuoka
IPC: H01L21/82 , H01L21/32 , H01L21/8234 , H01L29/66
Abstract: Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.
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公开(公告)号:US10770355B2
公开(公告)日:2020-09-08
申请号:US16394589
申请日:2019-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Je-min Yoo , Sang-deok Kwon , Yuri Masuoka
IPC: H01L21/82 , H01L21/32 , H01L21/8234 , H01L29/66
Abstract: Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.
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公开(公告)号:US20200058559A1
公开(公告)日:2020-02-20
申请号:US16394589
申请日:2019-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Je-min Yoo , Sang-deok Kwon , Yuri Masuoka
IPC: H01L21/8234 , H01L29/66 , H01L21/32
Abstract: Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.
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公开(公告)号:US20200052116A1
公开(公告)日:2020-02-13
申请号:US16508774
申请日:2019-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: SEUNG KWON KIM , Yuri Masuoka
IPC: H01L29/78 , H01L27/092 , H01L29/08 , H01L29/165 , H01L29/36 , H01L29/10 , H01L29/16
Abstract: A semiconductor device is provided. The semiconductor device includes a substrate including first through third regions, a first transistor of a first conductivity type disposed on the first region of the substrate and including a first channel layer, in which the first channel layer includes a first material, a second transistor of a second conductivity type different from the first conductivity type disposed on the second region of the substrate and including a second channel layer, in which the second channel layer includes the first material, and a third transistor of the second conductivity type disposed on the third region of the substrate and including a third channel layer, in which the third channel layer includes a second material different from the first material.
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公开(公告)号:US11222978B2
公开(公告)日:2022-01-11
申请号:US16019811
申请日:2018-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yul Lee , Yuri Masuoka
IPC: H01L31/072 , H01L29/78 , H01L29/66 , H01L21/28 , H01L21/762 , H01L29/08
Abstract: A semiconductor device includes at least one active pattern on a substrate, at least one gate electrode intersecting the at least one active pattern, source/drain regions on the at least one active pattern, the source/drain regions being on opposite sides of the at least one gate electrode, and a barrier layer between at least one of the source/drain regions and the at least one active pattern, the barrier layer being at least on bottoms of the source/drain regions and including oxygen.
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公开(公告)号:US09673106B2
公开(公告)日:2017-06-06
申请号:US14956522
申请日:2015-12-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: So-Yeon Kim , Yuri Masuoka
IPC: H01L29/423 , H01L21/8238 , H01L21/84 , H01L27/092 , H01L27/12
CPC classification number: H01L21/823821 , H01L21/845 , H01L27/0924 , H01L27/1211
Abstract: A semiconductor device includes a substrate including an active fin and an isolation layer thereon, a first gate structure on the active fin, the first gate structure including a first gate insulation layer pattern and a first metal pattern, and the first metal pattern having a first conductivity type and directly contacting the first gate insulation layer pattern, a first channel region at a portion of the active fin facing a bottom surface of the first gate structure, the first channel region including impurities having the first conductivity type, and first source/drain regions at upper portions of the active fin adjacent to opposite sidewalls of the first gate structure, the first source/drain regions including impurities having a second conductivity type different from the first conductivity type.
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