Semiconductor device and method of fabricating the same

    公开(公告)号:US10707234B2

    公开(公告)日:2020-07-07

    申请号:US16204637

    申请日:2018-11-29

    Abstract: A semiconductor device comprises: a substrate; a first well region of a first conductivity type and a second well region of a second conductivity type formed horizontally adjacent to each other in the substrate; a buried insulation layer formed on the first well region and the second well region; a first semiconductor layer formed to vertically overlap the first well region, and a second semiconductor layer formed to vertically overlap the second well region, on the buried insulation layer; a first isolation layer formed between the first semiconductor layer and the second semiconductor layer on the buried insulation layer; and a conductive layer formed on the first semiconductor layer and the second semiconductor layer to extend over the first semiconductor layer and the second semiconductor layer.

    Semiconductor device
    3.
    发明授权

    公开(公告)号:US11469228B2

    公开(公告)日:2022-10-11

    申请号:US17146938

    申请日:2021-01-12

    Abstract: Disclosed is a semiconductor device comprising a substrate including PMOSFET and NMOSFET regions, first active fins at the PMOSFET region, second active fins at the NMOSFET region, a gate electrode extending in a first direction and running across the first and second active fins, a first source/drain pattern on the first active fins and connecting the first active fins to each other, a second source/drain pattern on the second active fins and connecting the second active fins to each other, a first active contact electrically connected to the first source/drain pattern, and a second active contact electrically connected to the second source/drain pattern. A maximum width of the first active contact in the first direction is less than a maximum width of the second active in the first direction.

    Semiconductor devices with various line widths and method of manufacturing the same

    公开(公告)号:US10916476B2

    公开(公告)日:2021-02-09

    申请号:US16901484

    申请日:2020-06-15

    Abstract: Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.

    Semiconductor devices with various line widths and method of manufacturing the same

    公开(公告)号:US10770355B2

    公开(公告)日:2020-09-08

    申请号:US16394589

    申请日:2019-04-25

    Abstract: Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.

    SEMICONDUCTOR DEVICES WITH VARIOUS LINE WIDTHS AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200058559A1

    公开(公告)日:2020-02-20

    申请号:US16394589

    申请日:2019-04-25

    Abstract: Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.

    SEMICONDUCTOR DEVICE
    7.
    发明申请

    公开(公告)号:US20200052116A1

    公开(公告)日:2020-02-13

    申请号:US16508774

    申请日:2019-07-11

    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate including first through third regions, a first transistor of a first conductivity type disposed on the first region of the substrate and including a first channel layer, in which the first channel layer includes a first material, a second transistor of a second conductivity type different from the first conductivity type disposed on the second region of the substrate and including a second channel layer, in which the second channel layer includes the first material, and a third transistor of the second conductivity type disposed on the third region of the substrate and including a third channel layer, in which the third channel layer includes a second material different from the first material.

    Semiconductor devices and methods of manufacturing the same

    公开(公告)号:US09673106B2

    公开(公告)日:2017-06-06

    申请号:US14956522

    申请日:2015-12-02

    CPC classification number: H01L21/823821 H01L21/845 H01L27/0924 H01L27/1211

    Abstract: A semiconductor device includes a substrate including an active fin and an isolation layer thereon, a first gate structure on the active fin, the first gate structure including a first gate insulation layer pattern and a first metal pattern, and the first metal pattern having a first conductivity type and directly contacting the first gate insulation layer pattern, a first channel region at a portion of the active fin facing a bottom surface of the first gate structure, the first channel region including impurities having the first conductivity type, and first source/drain regions at upper portions of the active fin adjacent to opposite sidewalls of the first gate structure, the first source/drain regions including impurities having a second conductivity type different from the first conductivity type.

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