Abstract:
A method of operating a haptic-enabled electronic device includes detecting an input interaction between the haptic-enabled electronic device and a touchscreen-enabled electronic device selecting a vibration command in associated with the input, and vibrating the haptic-enabled electronic device in response to the vibration command.
Abstract:
The present invention relates to a voice signal processing method according to a state of an electronic device, and an electronic device therefor. An electronic device according to various embodiments comprises: a microphone; and a processor, wherein the processor can be configured to: obtain a voice signal using the microphone, check a state of the electronic device, and generate a first voice signal by filtering the voice signal using a first method, at least based on a determination of the electronic device being in a first state; generate a second voice signal by filtering the voice signal using a second method, at least based on a determination of the electronic device being in a second state; and transmit to an external electronic device a corresponding voice signal of the first voice signal or the second voice signal. In addition, other embodiments are possible.
Abstract:
An electronic device and a method for sending a response message according to a current status are provided. An operating method of the electronic device includes determining whether a received message is confirmed within a preset time, when the received message is not confirmed within the preset time, determining whether a contact number of a sender electronic device is a preset contact number, and when the contact number of the sender electronic device is the preset contact number, sending an automatic response message to the sender electronic device corresponding to a preset automatic response message status.
Abstract:
In a method of manufacturing a GaN substrate, a capping layer may be formed on a first surface of a silicon substrate. A buffer layer may be formed on a second surface of the silicon substrate. The second surface may be opposite the first surface. A GaN substrate may be formed on the buffer layer by performing a hydride vapor phase epitaxy (HVPE) process. The capping layer and the silicon substrate may be removed.
Abstract:
Provided are a semipolar nitride semiconductor structure and a method of manufacturing the same. The semipolar nitride semiconductor structure includes a silicon substrate having an Si(11k) surface satisfying 7≦k≦13; and a nitride semiconductor layer formed on the silicon substrate. The nitride semiconductor layer has a semipolar characteristic in which a polarization field is approximately 0.