公开(公告)号：US5306754A

公开(公告)日：1994-04-26

申请号：US32864

申请日：1993-03-17

申请人： Sanehiro Yamamoto ,  Kazuto Sugiyama ,  Akinori Toyota ,  Yoshikatsu Amimoto ,  Fumitoshi Ikejiri ,  Tetsuo Kato ,  Masahiro Kanda

发明人： Sanehiro Yamamoto ,  Kazuto Sugiyama ,  Akinori Toyota ,  Yoshikatsu Amimoto ,  Fumitoshi Ikejiri ,  Tetsuo Kato ,  Masahiro Kanda

IPC分类号： C08K5/13 ,  C08K5/36 ,  C08K5/372 ,  C08L23/26 ,  C08L77/00 ,  C08L77/06 ,  C08L77/10 ,  H01B3/30 ,  H01R13/46 ,  C08K13/00

CPC分类号： H01B3/306 ,  C08K5/13 ,  C08K5/372 ,  C08L77/10

摘要： The resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.

摘要翻译： 本发明的树脂组合物包含作为树脂组分的特定芳族聚酰胺（A），特定的接枝改性聚合物（B），脂肪族聚酰胺（C）和多种抗氧化剂，其包含具有分子量的受阻酚型抗氧化剂 不低于500，TGA 10％重量减轻温度不低于300℃，分子量不小于600的硫型抗氧化剂（E）和TGA 10％重量损失温度不低于 280℃。本发明的连接器具有由上述树脂组合物形成的壳体。 本发明的树脂组合物显示出优异的耐热性。 本发明的连接器重量轻，耐热性，耐水性和耐化学性优异。

公开(公告)号：US5424104A

公开(公告)日：1995-06-13

申请号：US178616

申请日：1994-01-07

申请人： Yoshikatsu Amimoto ,  Fumitoshi Ikejiri ,  Sanehiro Yamamoto ,  Akinori Toyota ,  Katunari Nishimura ,  Masahiro Kanda ,  Tetsuo Kato

发明人： Yoshikatsu Amimoto ,  Fumitoshi Ikejiri ,  Sanehiro Yamamoto ,  Akinori Toyota ,  Katunari Nishimura ,  Masahiro Kanda ,  Tetsuo Kato

IPC分类号： C08L51/06 ,  C08K5/49 ,  C08K5/524 ,  C08L77/00 ,  C08L77/06 ,  H01R13/46 ,  B29D22/00 ,  B29D23/00

CPC分类号： C08L77/00

摘要： Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).

摘要翻译： 公开了一种热塑性树脂组合物，其包含（A）包含二羧酸单元的芳族聚酰胺，所述二羧酸单元包含50-100摩尔％的由对苯二甲酸衍生的单元，以及0-50摩尔％的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸，以及衍生自脂族二胺和/或脂环族二胺的二胺单元，所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃，熔点高于300℃，（B）接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和（ C）脂肪族聚酰胺，其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物（B）和5- 基于100重量份的芳族聚酰胺（A），80重量份的脂肪族聚酰胺（C）。

公开(公告)号：US5763517A

公开(公告)日：1998-06-09

申请号：US721272

申请日：1996-09-26

申请人： Sanehiro Yamamoto ,  Kazuto Sugiyama ,  Akinori Toyota ,  Yoshikatsu Amimoto ,  Fumitoshi Ikejiri

发明人： Sanehiro Yamamoto ,  Kazuto Sugiyama ,  Akinori Toyota ,  Yoshikatsu Amimoto ,  Fumitoshi Ikejiri

IPC分类号： C08F255/02 ,  C08F255/08 ,  C08F279/00 ,  C08F283/14 ,  C08K5/13 ,  C08K5/36 ,  C08K5/372 ,  C08L23/26 ,  C08L51/04 ,  C08L51/06 ,  C08L77/00 ,  C08L77/06

CPC分类号： C08L51/06 ,  C08F255/02 ,  C08F255/08 ,  C08F279/00 ,  C08F283/14 ,  C08K5/13 ,  C08K5/372 ,  C08L51/04 ,  C08L77/00 ,  C08L77/06

摘要： The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280.degree. C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300.degree. C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.

摘要翻译： 本发明的热塑性树脂组合物包含（A）熔点不低于280℃的聚酰胺，特别优选熔点高于300℃的（A-1）特定聚酰胺，（B） 特定的改性聚合物，（C）分子量不小于500的TGA 10％失重温度不低于300℃的受阻酚型抗氧化剂，（D）具有分子量 重量不低于600，TGA 10％重量减少温度不低于280℃。本发明的成型产品由上述热塑性树脂组合物制成。 本发明的热塑性树脂组合物的热稳定性优良。

公开(公告)号：US5849826A

公开(公告)日：1998-12-15

申请号：US860250

申请日：1997-06-25

申请人： Yoshimasa Ogo ,  Hidetatsu Murakami ,  Kunihiro Oouchi ,  Masaru Sudou ,  Yoshikatsu Amimoto ,  Satoshi Omori ,  Kenji Wakatsuru ,  Ryuichi Hayashi ,  Masahiro Nozaki

发明人： Yoshimasa Ogo ,  Hidetatsu Murakami ,  Kunihiro Oouchi ,  Masaru Sudou ,  Yoshikatsu Amimoto ,  Satoshi Omori ,  Kenji Wakatsuru ,  Ryuichi Hayashi ,  Masahiro Nozaki

IPC分类号： C08G69/26 ,  C08G69/36 ,  C08K3/22 ,  C08K5/03 ,  C08K5/136 ,  C08G69/06 ,  C08G69/28 ,  C08G69/30

CPC分类号： C08K5/03 ,  C08G69/265 ,  C08G69/36 ,  C08K3/2279 ,  C08K5/136

摘要： The semiaromatic polyamide of the invention comprises 40 to 90% by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50% by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60% by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50% by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25% by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.

摘要翻译： PCT No.PCT / JP96 / 03107 Sec。 371日期：1997年6月25日 102（e）日期1996年6月25日PCT 1996年10月24日PCT公布。 公开号WO97 / 15610PC 日本1997年5月1日本发明的半芳族聚酰胺包含40〜90摩尔％的（A）来自对苯二甲酸和4〜12个碳原子的脂肪族二胺的重复单元，（B）重复单元0〜50摩尔％ 衍生自间苯二甲酸和4〜12个碳原子的脂族二胺，0〜60摩尔％的（C）碳原子数4〜18的脂肪族二羧酸的重复单元和4〜12个碳原子的脂肪族二胺， 0〜50摩尔％的（D）来自内酰胺或6〜20个碳原子的氨基羧酸的重复单元，沸水溶性成分（MO成分）的含量为0.25重量％以下。 半芳族聚酰胺的MO成分含量低，因此在成型过程中几乎不产生模具污染，并且还可以制造耐热性良好的成型品。

公开(公告)号：US6117942A

公开(公告)日：2000-09-12

申请号：US038982

申请日：1998-03-12

申请人： Yoshimasa Ogo ,  Yoshikatsu Amimoto

发明人： Yoshimasa Ogo ,  Yoshikatsu Amimoto

IPC分类号： C08L77/00 ,  C08L77/06 ,  C08G63/48

CPC分类号： C08L77/00 ,  C08L77/06

摘要： A semiaromatic polyamide resin composition of the present invention contains a polyamide (A) in which a dicarboxylic acid component unit comprises a terephthalic acid component unit and a diamine component unit comprises a straight-chain alkylenediamine component unit and an alkylenediamine component unit having a side-chain alkyl group; and a modified ethylene/.alpha.-olefin copolymer (B) obtained by graft-modifying an ethylene/.alpha.-olefin copolymer having particular properties with an unsaturated carboxylic acid or a derivative thereof. A molded article obtained by using this composition exhibits excellent anti-creeping property under high-temperature and high-humidity conditions, and causes the metal mold to be little fouled during the molding operation.

摘要翻译： 本发明的半芳族聚酰胺树脂组合物包含其中二羧酸组分单元包括对苯二甲酸组分单元和二胺组分单元包含直链亚烷基二胺组分单元和亚烷基二胺组分单元的聚酰胺（A） 链烷基; 和通过用不饱和羧酸或其衍生物接枝改性具有特定性能的乙烯/α-烯烃共聚物而得到的改性乙烯/α-烯烃共聚物（B）。 通过使用该组合物得到的成型体在高温高湿条件下表现出优异的抗蠕变性，并且在成型操作中导致金属模不易弄脏。

公开(公告)号：US06319986B1

公开(公告)日：2001-11-20

申请号：US09345408

申请日：1999-07-01

申请人： Yoshikatsu Amimoto ,  Yoshimasa Ogo ,  Masayuki Sakka

发明人： Yoshikatsu Amimoto ,  Yoshimasa Ogo ,  Masayuki Sakka

IPC分类号： C08L7700

CPC分类号： C08L77/02 ,  C08L51/00 ,  C08L51/003 ,  C08L51/06 ,  C08L77/00 ,  C08L77/06 ,  Y10T428/1352 ,  C08L2666/02

摘要： A semiaromatic polyamide resin composition comprising: (A) a polyamide copolymer in which a main constituent component unit is a polyamide formed of a recurring unit of a dicarboxylic acid component unit and a diamine component unit, at least not less than 45 mol % of said dicarboxylic acid component unit being a terephthalic acid component unit, and said diamine component unit comprising a straight-chain alkylenediamine component unit and/or an alkylenediamine component unit having a side-chain alkyl group; (B) an aliphatic polyamide containing, a unit derived from a lactam having 12 carbon atoms, a unit derived from an aminocarboxylic acid having 12 carbon atoms or a unit derived from a dodecanoic diacid and a diamine; and (C) a graft-modified product of a graft-modified ethylene/&agr;-olefin copolymer, a graft-modified product of an aromatic vinyl compound/conjugated diene copolymer, or a graft-modified product of a hydrogenated product of the aromatic vinyl compound/conjugated diene copolymer. The resin composition little precipitates the oligomer during the molding, little causes the vent of the metal mold to be clogged, is suited for conducting the molding operation for extended periods of time, and further exhibits excellent resistance against aging by heat, anti-creeping property, shock resistance and ejectability.

摘要翻译： 一种半芳族聚酰胺树脂组合物，其包含：（A）主要构成成分单元是由二羧酸成分单元的重复单元形成的聚酰胺和二胺成分单元的聚酰胺共聚物，所述聚酰胺共聚物的摩尔比例至少为所述 二羧酸成分单元为对苯二甲酸成分单元，所述二胺成分单元包含直链亚烷基二胺成分单元和/或具有侧链烷基的亚烷基二胺成分单元;（B）含有单体衍生物 来自具有12个碳原子的内酰胺，衍生自具有12个碳原子的氨基羧酸的单元或衍生自十二烷二酸的单元和二胺; 和（C）接枝改性的乙烯/α-烯烃共聚物的接枝改性产物，芳族乙烯基化合物/共轭二烯共聚物的接枝改性产物或芳族乙烯基共聚物的氢化产物的接枝改性产物 化合物/共轭二烯共聚物。 树脂组合物在模塑过程中几乎不使低聚物沉淀，很少导致金属模具的排气堵塞，适合长时间进行模塑操作，并且进一步表现出优异的耐热老化性，抗蠕变性 ，抗冲击性和弹性。