摘要:
An electrical connector to be electrically disposed between a first circuit board and a second circuit board to electrically couple the first circuit board with the second circuit board is disclosed. The electrical connector may have an electro-optic modulator to modulate optical signals based on electrical signals exchanged between the first and second circuit boards through the electrical connector. Systems incorporating such electrical connectors, and methods of using the electrical connectors and systems, such as for debug, are also disclosed.
摘要:
An electrical connector to be electrically disposed between a first circuit board and a second circuit board to electrically couple the first circuit board with the second circuit board is disclosed. The electrical connector may have an electro-optic modulator to modulate optical signals based on electrical signals exchanged between the first and second circuit boards through the electrical connector. Systems incorporating such electrical connectors, and methods of using the electrical connectors and systems, such as for debug, are also disclosed.
摘要:
A method for performing analysis of electrical signals in a system is disclosed. The system includes at least two circuit elements between which an electrical signal is transmitted. The method converts the electrical signal to dual optical signals, one of which is converted back to an electrical signal for receipt by the intended circuit element. The second optical signal may be transmitted a great distance, relative to electrical signals, allowing for remote analysis of the signal. The loss in converting the electrical signal to an optical signal, then back to an electrical signal is low compared to other debug methods. The method may be performed with high-speed signals.
摘要:
Testing microelectronic devices using electro-optic modulator probes is disclosed. In one aspect, a testing apparatus may include an electrical signaling medium to exchange electrical signals with a microelectronic device. The testing apparatus may include an electro-optic modulator probe to provide optical signals that are modulated by the electrical signals. An optoelectronic transducer may be included to convert the modulated optical signals to modulated electrical signals. The testing apparatus may further include a logic analyzer module to receive and analyze the modulated electrical signals. Other testing apparatus are disclosed, as well as systems incorporating such apparatus, and various methods of testing microelectronic devices.
摘要:
In one embodiment, the present invention includes a method for receiving an error correction code for information from a first port of a first agent and receiving the information from a second port of the first agent by probing a first link under test that couples the first agent and a second agent. The code may be used to validate the information, e.g., in a probe receiver during test or debug operations. Other embodiments are described and claimed.
摘要:
In one embodiment, the present invention includes a method for receiving an error correction code for information from a first port of a first agent and receiving the information from a second port of the first agent by probing a first link under test that couples the first agent and a second agent. The code may be used to validate the information, e.g., in a probe receiver during test or debug operations. Other embodiments are described and claimed.
摘要:
In general, in one aspect, the disclosure describes an apparatus having an averager to receive differential output voltages of a transmitter and generate an average transmitter output voltage. A comparator is to compare the average transmitter output voltage to a reference voltage and generate a difference therebetween. An integrator is to integrate the difference between the average transmitter output voltage and the reference voltage over time. The integrated difference is fed back to the transmitter to bias the transmitter.
摘要:
Systems and methods of managing a link provide for receiving a remote width capability during a link initialization, the remote width capability corresponding to a remote port. A link between a local port and the remote port is operated at a plurality of link widths in accordance with the remote width capability.
摘要:
A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.