METHOD OF MANUFACTURING MAGNETORESISTIVE ELEMENT
    1.
    发明申请
    METHOD OF MANUFACTURING MAGNETORESISTIVE ELEMENT 有权
    制造磁性元件的方法

    公开(公告)号:US20150072439A1

    公开(公告)日:2015-03-12

    申请号:US14200510

    申请日:2014-03-07

    IPC分类号: H01L43/12

    CPC分类号: H01L43/12 H01L27/228

    摘要: According to one embodiment, a method of manufacturing a magnetoresistive element, the method includes forming a first non-magnetic layer on a first magnetic layer, forming a second magnetic layer on the first non-magnetic layer, forming a second non-magnetic layer on the second magnetic layer, forming a third magnetic layer on the second non-magnetic layer, patterning the third magnetic layer by a RIE using an etching gas including a noble gas and a nitrogen gas until a surface of the second non-magnetic layer is exposed, and patterning the second non-magnetic layer and the second magnetic layer after patterning of the third magnetic layer.

    摘要翻译: 根据一个实施例,一种制造磁阻元件的方法,该方法包括在第一磁性层上形成第一非磁性层,在第一非磁性层上形成第二磁性层,在第一非磁性层上形成第二非磁性层 第二磁性层,在第二非磁性层上形成第三磁性层,使用包括惰性气体和氮气的蚀刻气体,通过RIE对第三磁性层进行构图,直到第二非磁性层的表面露出 并且在第三磁性层的图案化之后图案化第二非磁性层和第二磁性层。

    MAGNETIC MEMORY DEVICE AND METHOD OF MANUFACTURING MAGNETIC MEMORY DEVICE
    3.
    发明申请
    MAGNETIC MEMORY DEVICE AND METHOD OF MANUFACTURING MAGNETIC MEMORY DEVICE 有权
    磁记忆体装置及制造磁记忆装置的方法

    公开(公告)号:US20160079519A1

    公开(公告)日:2016-03-17

    申请号:US14639675

    申请日:2015-03-05

    IPC分类号: H01L43/08 H01L27/22 H01L43/12

    摘要: According to one embodiment, a method of manufacturing a magnetic memory device includes a stack structure formed of a plurality of layers including a magnetic layer, the method includes forming a lower structure film including at least one layer, etching the lower structure film to form a lower structure of the stack structure, forming an upper structure film including at least one layer on a region including the lower structure, and etching the upper structure film to form an upper structure of the stack structure on the lower structure.

    摘要翻译: 根据一个实施例,一种制造磁存储器件的方法包括由包括磁性层的多个层形成的堆叠结构,该方法包括形成包括至少一层的下部结构膜,蚀刻下部结构膜以形成 堆叠结构的下部结构,在包括下部结构的区域上形成包括至少一个层的上部结构膜,并且蚀刻上部结构膜以在下部结构上形成堆叠结构的上部结构。

    MAGNETIC MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    MAGNETIC MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    磁记忆体装置及其制造方法

    公开(公告)号:US20160072050A1

    公开(公告)日:2016-03-10

    申请号:US14642506

    申请日:2015-03-09

    IPC分类号: H01L43/08 H01L43/12 H01L43/02

    CPC分类号: H01L43/08 H01L43/02 H01L43/12

    摘要: According to one embodiment, a magnetic memory device includes a first stack structure including a first magnetic layer, and a first nonmagnetic layer provided on the first magnetic layer, a second stack structure including a second magnetic layer provided on the first nonmagnetic layer, a second nonmagnetic layer provided on the second magnetic layer, and a top conductive layer provided on the second nonmagnetic layer, and a sidewall conductive layer provided on a sidewall of the second stack structure.

    摘要翻译: 根据一个实施例,磁存储器件包括第一堆叠结构,其包括第一磁性层和设置在第一磁性层上的第一非磁性层,第二堆叠结构,包括设置在第一非磁性层上的第二磁性层,第二层 设置在第二磁性层上的非磁性层和设置在第二非磁性层上的顶部导电层,以及设置在第二堆叠结构的侧壁上的侧壁导电层。

    MAGNETIC MEMORY HAVING MAGNETORESISTIVE ELEMENT AND METHOD OF MANUFACTURING MAGNETORESISTIVE ELEMENT
    5.
    发明申请
    MAGNETIC MEMORY HAVING MAGNETORESISTIVE ELEMENT AND METHOD OF MANUFACTURING MAGNETORESISTIVE ELEMENT 有权
    具有磁性元件的磁记忆和制造磁性元件的方法

    公开(公告)号:US20150263273A1

    公开(公告)日:2015-09-17

    申请号:US14479180

    申请日:2014-09-05

    IPC分类号: H01L43/12 H01L43/02 H01L27/22

    摘要: According to one embodiment, a magnetic memory includes a transistor having first and second diffusion layers in a semiconductor substrate and a gate electrode between the first and second diffusion layers, a first insulating layer on the semiconductor substrate, the first insulating layer covering the transistor, a first contact plug in the first insulating layer, the first contact plug connected to the first diffusion layer, a second contact plug in the first insulating layer, the second contact plug connected to the second diffusion layer, a magnetoresistive element on the first insulating layer, the magnetoresistive element connected to the first contact plug, an electrode on the magnetoresistive element, and an impurity region in the first insulating layer, the second contact plug, and the electrode.

    摘要翻译: 根据一个实施例,磁存储器包括在半导体衬底中具有第一和第二扩散层的晶体管和位于第一和第二扩散层之间的栅电极,半导体衬底上的第一绝缘层,覆盖晶体管的第一绝缘层, 第一绝缘层中的第一接触插塞,连接到第一扩散层的第一接触插塞,第一绝缘层中的第二接触插塞,连接到第二扩散层的第二接触插塞,第一绝缘层上的磁阻元件 连接到第一接触插塞的磁阻元件,磁阻元件上的电极以及第一绝缘层,第二接触插塞和电极中的杂质区域。

    MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE
    10.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE 审中-公开
    半导体存储器件的制造方法

    公开(公告)号:US20160072055A1

    公开(公告)日:2016-03-10

    申请号:US14630412

    申请日:2015-02-24

    IPC分类号: H01L43/12 H01L43/02 H01L43/08

    CPC分类号: H01L43/12 H01L27/228

    摘要: According to one embodiment, a manufacturing method of a semiconductor memory device includes the following steps. The method includes forming a first magnetic layer, a second magnetic layer, and an insulating layer therebetween, forming a mask layer on the second magnetic layer, etching the second magnetic layer, the insulating layer, and the first magnetic layer using the mask layer as a mask and forming a magnetic tunnel junction (MTJ) element, and performing oxidation a sidewall of the MTJ element with H2O.

    摘要翻译: 根据一个实施例,半导体存储器件的制造方法包括以下步骤。 该方法包括在其间形成第一磁性层,第二磁性层和绝缘层,在第二磁性层上形成掩模层,使用掩模层蚀刻第二磁性层,绝缘层和第一磁性层作为 掩模和形成磁隧道结(MTJ)元件,并用H 2 O进行MTJ元件的侧壁氧化。