Integration of FinFETs and Schottky Diodes on a Substrate

    公开(公告)号:US20230080635A1

    公开(公告)日:2023-03-16

    申请号:US17950952

    申请日:2022-09-22

    Inventor: Pierre Dermy

    Abstract: This application is directed to integrating a field-effect transistor (FinFET) and a Schottky barrier diode on a substrate. A first fin structure and a second fin structure are formed on the substrate. The first fin structure includes a channel portion extending to two stressor portions on two opposite sides of the channel portion, and the second fin structure includes a junction portion. A source structure and a drain structure of the FinFET are formed on the two stressor portions of the first fin structure, respectively. A source metallic material, a drain metallic material, a first metallic material are formed to electrically couple to the source structure, the drain structure, and the junction portion of the second fin structure, respectively, thereby providing a Schottky junction between the junction portion of the second fin structure and the first metallic material.

Patent Agency Ranking