Substrate processing apparatus and substrate processing method
    7.
    发明申请
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US20060104635A1

    公开(公告)日:2006-05-18

    申请号:US11273439

    申请日:2005-11-10

    IPC分类号: G03D5/00

    CPC分类号: G03F7/70991 Y10S414/135

    摘要: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

    摘要翻译: 基板处理装置包括分度器块,抗反射膜处理块,抗蚀剂膜处理块,显影处理块,抗蚀剂覆盖膜处理块,抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前,在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。

    Substrate processing apparatus and substrate processing method
    8.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US07726891B2

    公开(公告)日:2010-06-01

    申请号:US11273439

    申请日:2005-11-10

    IPC分类号: G03D5/00 G03B27/32 B05C11/00

    CPC分类号: G03F7/70991 Y10S414/135

    摘要: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

    摘要翻译: 基板处理装置包括分度器块,抗反射膜处理块,抗蚀剂膜处理块,显影处理块,抗蚀剂覆盖膜处理块,抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前,在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。

    Substrate processing apparatus and substrate processing method
    9.
    发明申请
    Substrate processing apparatus and substrate processing method 审中-公开
    基板加工装置及基板处理方法

    公开(公告)号:US20050220985A1

    公开(公告)日:2005-10-06

    申请号:US11130376

    申请日:2005-05-16

    摘要: A substrate processing apparatus is provided with a film quality measuring device that measures the density of a resist film on a substrate as the film quality. Measurement of the density of the resist film is performed after resist-coating or during or after heat-treatment followed by the resist-coating. The film quality measuring device also measures the thickness of the resist film on the substrate before exposure after the heat-treatment followed by the resist-coating. A controller controls a processing condition in a coater or a heating device so that each of the density and thickness of the resist film on the substrate falls within an acceptable range.

    摘要翻译: 基板处理装置设置有膜质量测量装置,其测量作为膜质量的基板上的抗蚀剂膜的密度。 抗蚀剂膜的密度的测量在抗蚀涂层之后或在热处理之后或之后进行抗蚀剂涂覆。 膜质量测量装置还测量在热处理之后的抗蚀剂涂层之前的曝光之前的基板上的抗蚀剂膜的厚度。 控制器控制涂布机或加热装置中的处理条件,使得基板上的抗蚀剂膜的密度和厚度各自在可接受的范围内。

    Substrate processing apparatus and method including a device for applying a coating and a device for measuring the film quality of the coating
    10.
    发明授权
    Substrate processing apparatus and method including a device for applying a coating and a device for measuring the film quality of the coating 失效
    基板处理装置和方法,包括涂覆装置和用于测量涂层膜质量的装置

    公开(公告)号:US06913781B2

    公开(公告)日:2005-07-05

    申请号:US10170776

    申请日:2002-06-12

    摘要: A substrate processing apparatus is provided with five inspection devices that perform inspections of different kinds to a substrate. Among the five kinds of inspections, the film quality is measured after resist coating, and before post-coating heat-treatment. As the film quality, the amount of solvent remaining in a resist film is measured. The film thickness is measured after heat-treatment following resist coating and before exposure. Meanwhile, the line width and the superposition precision are measured and macroscopic defect inspection is performed after post-development heat-treatment and before the substrate is returned to an indexer.

    摘要翻译: 基板处理装置设置有五个检查装置,其对基板执行不同种类的检查。 在五种检查中,电影质量在抗蚀涂层后和涂布前热处理后进行测量。 作为膜质量,测定保留在抗蚀剂膜中的溶剂量。 在抗蚀涂层和曝光前的热处理后测量膜厚度。 同时,测量线宽和叠加精度,并且在显影后热处理之后并且在将基板返回到分度器之前进行宏观缺陷检查。