Substrate processing apparatus and substrate processing method
    7.
    发明申请
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US20060104635A1

    公开(公告)日:2006-05-18

    申请号:US11273439

    申请日:2005-11-10

    IPC分类号: G03D5/00

    CPC分类号: G03F7/70991 Y10S414/135

    摘要: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

    摘要翻译: 基板处理装置包括分度器块,抗反射膜处理块,抗蚀剂膜处理块,显影处理块,抗蚀剂覆盖膜处理块,抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前,在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。

    Substrate processing apparatus and substrate processing method
    8.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US07726891B2

    公开(公告)日:2010-06-01

    申请号:US11273439

    申请日:2005-11-10

    IPC分类号: G03D5/00 G03B27/32 B05C11/00

    CPC分类号: G03F7/70991 Y10S414/135

    摘要: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

    摘要翻译: 基板处理装置包括分度器块,抗反射膜处理块,抗蚀剂膜处理块,显影处理块,抗蚀剂覆盖膜处理块,抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前,在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。

    Processing system hot plate construction substrate
    9.
    发明授权
    Processing system hot plate construction substrate 失效
    加工系统热板施工基板

    公开(公告)号:US5927077A

    公开(公告)日:1999-07-27

    申请号:US839264

    申请日:1997-04-17

    IPC分类号: H01L21/00 F25B21/02

    CPC分类号: H01L21/67103

    摘要: In a substrate thermal processing device, a temperature of a substrate can be precisely controlled within a short time by means of a hot plate oven. The substrate thermal processing device includes a substrate supporting plate for supporting the substrate, an auxiliary heating/cooling section for heating or cooling the substrate and having a Peltier effect element and disposed on a lower surface of the substrate supporting plate, and a main heating section for heating the substrate and disposed below the substrate supporting plate and the auxiliary heating/cooling section.

    摘要翻译: 在基板热处理装置中,可以通过热板式烘箱在短时间内精确地控制基板的温度。 基板热处理装置包括用于支撑基板的基板支撑板,用于加热或冷却基板的辅助加热/冷却部分,并具有珀耳帖效应元件并设置在基板支撑板的下表面上,主加热部分 用于加热基板并且设置在基板支撑板和辅助加热/冷却部分下方。

    Apparatus for and method of thermally processing substrate
    10.
    发明授权
    Apparatus for and method of thermally processing substrate 失效
    基板热处理装置及方法

    公开(公告)号:US6080969A

    公开(公告)日:2000-06-27

    申请号:US85631

    申请日:1998-05-27

    CPC分类号: H01L21/67103

    摘要: A substrate thermal processing apparatus easily changes a set temperature at which a substrate is set while thermally processed. A heating plate of the substrate thermal processing apparatus comprises a substrate supporting plate which supports a substrate, an auxiliary heating portion and a main heating portion, and a cooling Peltier element and a water cooling jacket. For heating a substrate, heat which is generated at the main heating portion which comprises a heater portion is transmitted to the substrate supporting plate through the auxiliary heating portion which comprises a Peltier element, so that the substrate is heated up. When the temperature of the substrate supporting plate is to be decreased, the auxiliary heating portion and the cooling Peltier element guide the heat of the substrate supporting plate to the water cooling jacket, and the heat is discharged outside by cooling water.

    摘要翻译: 基板热处理装置在热处理时容易地改变设置基板的设定温度。 基板热处理装置的加热板包括支撑基板的基板支撑板,辅助加热部和主加热部,以及冷却珀耳帖元件和水冷套。 为了加热基板,在包括加热器部分的主加热部分处产生的热量通过包括珀尔帖元件的辅助加热部分传递到基板支撑板,使得基板被加热。 当基板支撑板的温度降低时,辅助加热部分和冷却珀耳帖元件将基板支撑板的热量引导到水冷套,并且热量通过冷却水排出到外部。