摘要:
An opto-thermal annealing method for forming a field effect transistor uses a reflective metal gate so that electrical properties of the metal gate and also interface between the metal gate and a gate dielectric are not compromised when opto-thermal annealing a source/drain region adjacent the metal gate. Another opto-thermal annealing method may be used for simultaneously opto-thermally annealing: (1) a silicon layer and a silicide forming metal layer to form a fully silicided gate; and (2) a source/drain region to form an annealed source/drain region. An additional opto-thermal annealing method may use a thermal insulator layer in conjunction with a thermal absorber layer to selectively opto-thermally anneal a silicon layer and a silicide forming metal layer to form a fully silicide gate.
摘要:
An opto-thermal annealing method for forming a field effect transistor uses a reflective metal gate so that electrical properties of the metal gate and also interface between the metal gate and a gate dielectric are not compromised when opto-thermal annealing a source/drain region adjacent the metal gate. Another opto-thermal annealing method may be used for simultaneously opto-thermally annealing: (1) a silicon layer and a silicide forming metal layer to form a fully silicided gate; and (2) a source/drain region to form an annealed source/drain region. An additional opto-thermal annealing method may use a thermal insulator layer in conjunction with a thermal absorber layer to selectively opto-thermally anneal a silicon layer and a silicide forming metal layer to form a fully silicide gate.
摘要:
An opto-thermal annealing method for forming a field effect transistor uses a reflective metal gate so that electrical properties of the metal gate and also interface between the metal gate and a gate dielectric are not compromised when opto-thermal annealing a source/drain region adjacent the metal gate. Another opto-thermal annealing method may be used for simultaneously opto-thermally annealing: (1) a silicon layer and a silicide forming metal layer to form a fully silicided gate; and (2) a source/drain region to form an annealed source/drain region. An additional opto-thermal annealing method may use a thermal insulator layer in conjunction with a thermal absorber layer to selectively opto-thermally anneal a silicon layer and a silicide forming metal layer to form a fully silicide gate.
摘要:
An opto-thermal annealing method for forming a field effect transistor uses a reflective metal gate so that electrical properties of the metal gate and also interface between the metal gate and a gate dielectric are not compromised when opto-thermal annealing a source/drain region adjacent the metal gate. Another opto-thermal annealing method may be used for simultaneously opto-thermally annealing: (1) a silicon layer and a silicide forming metal layer to form a fully silicided gate; and (2) a source/drain region to form an annealed source/drain region. An additional opto-thermal annealing method may use a thermal insulator layer in conjunction with a thermal absorber layer to selectively opto-thermally anneal a silicon layer and a silicide forming metal layer to form a fully silicide gate.
摘要:
Fully silicided planar field effect transistors are formed by avoiding the conventional chemical-mechanical polishing step to expose the silicon gate by etching the sidewalls down to the silicon; depositing a sacrificial oxide layer thinner on the top of gate and sidewall of spacers, but thicker over the S/D areas, etching the oxide to expose the top of stacked gate while protecting the S/D; recessing the silicon; stripping the oxide; depositing metal and annealing to form silicide over the gate and S/D.
摘要:
Fully silicided planar field effect transistors are formed by avoiding the conventional chemical-mechanical polishing step to expose the silicon gate by etching the sidewalls down to the silicon; depositing a sacrificial oxide layer thinner on the top of gate and sidewall of spacers, but thicker over the S/D areas, etching the oxide to expose the top of stacked gate while protecting the S/D; recessing the silicon; stripping the oxide; depositing metal and annealing to form silicide over the gate and S/D.
摘要:
Methods of forming a self-aligned, selective semiconductor on insulator (SOI) structure and a related structure are disclosed. In one embodiment, a method includes providing a substrate; forming a gate structure over a channel within the substrate; recessing a portion of the substrate adjacent the channel; forming an insulating layer on a bottom of the recessed portion; and forming a semiconductor material above the insulating layer. An upper surface of the semiconductor material may be sloped. A MOSFET structure may include a substrate; a channel; a source region and a drain region adjacent the channel; a gate structure above the channel and the substrate; a shallow trench isolation (STI) distal from the gate structure; a selectively laid insulating layer in at least one of the source region and the drain region; and an epitaxially grown semiconductor material above the selectively laid insulating layer.
摘要:
A semiconductor structure and method for forming the same. First, a semiconductor structure is provided, including (a) a semiconductor layer including (i) a channel region and (ii) first and second source/drain (S/D) extension regions, and (iii) first and second S/D regions, (b) a gate dielectric region in direction physical contact with the channel region via a first interfacing surface that defines a reference direction essentially perpendicular to the first interfacing surface, and (c) a gate region in direct physical contact with the gate dielectric region, wherein the gate dielectric region is sandwiched between and electrically insulates the gate region and the channel region. Then, (i) a first shallow contact region is formed in direct physical contact with the first S/D extension region, and (ii) a first deep contact region is formed in direct physical contact with the first S/D region and the first shallow contact region.
摘要:
A semiconductor structure and method for forming the same. First, a semiconductor structure is provided, including (a) a semiconductor layer including (i) a channel region and (ii) first and second source/drain (S/D) extension regions, and (iii) first and second S/D regions, (b) a gate dielectric region in direction physical contact with the channel region via a first interfacing surface that defines a reference direction essentially perpendicular to the first interfacing surface, and (c) a gate region in direct physical contact with the gate dielectric region, wherein the gate dielectric region is sandwiched between and electrically insulates the gate region and the channel region. Then, (i) a first shallow contact region is formed in direct physical contact with the first S/D extension region, and (ii) a first deep contact region is formed in direct physical contact with the first S/D region and the first shallow contact region.
摘要:
A semiconductor structure and method for forming the same. The semiconductor structure comprises a field effect transistor (FET) having a channel region disposed between first and second source/drain (S/D) extension regions which are in turn in direct physical contact with first and second S/D regions, respective. First and second silicide regions are formed such that the first silicide region is in direct physical contact with the first S/D region and the first S/D extension region, whereas the second silicide region is in direct physical contact with the second S/D region and the second S/D extension region. The first silicide region is thinner for regions in contact with first S/D extension region than for regions in contact with the first S/D region. Similarly, the second silicide region is thinner for regions in contact with second S/D extension region than for regions in contact with the second S/D region.