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公开(公告)号：US20070235834A1
公开(公告)日：2007-10-11
申请号：US11631711
申请日：2005-07-06
申请人： Sebastian Brunner , Thomas Feichtinger , Gunter Pudmich , Horst Schlick , Patrick Schmidt-Winkel
发明人： Sebastian Brunner , Thomas Feichtinger , Gunter Pudmich , Horst Schlick , Patrick Schmidt-Winkel
IPC分类号： H01L21/20
CPC分类号： H05K3/4061 , H01L2924/0002 , H05K3/248 , H05K3/28 , H05K2201/035 , Y10T29/49155 , H01L2924/00
摘要： An electrical component includes a base body made using ceramic, metallization surfaces that at least partly define component structures on the base body, a passivation layer that is electrically insulating and over a surface of the base body, solder contacts on the passivation layer, and through-hole contacts inside the base body that are electrically connected to corresponding metallization surfaces. The solder contacts are electrically connected to corresponding through-hole contacts through the passivation layer.
摘要翻译： 电气部件包括使用陶瓷制成的基体，至少部分地限定基体上的部件结构的金属化表面，电绝缘并且在基体的表面上方的钝化层，钝化层上的焊料接触，以及通过 在基体内的电触点与相应的金属化表面电连接。 焊接触头通过钝化层与相应的通孔触点电连接。
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2.发明授权公开(公告)号：US07710710B2
公开(公告)日：2010-05-04
申请号：US11220352
申请日：2005-08-31
CPC分类号： H03H7/0107 , H01C7/1006 , H01C7/18 , H01G4/232 , H01G4/30 , H01G4/40
摘要： An electrical component includes ceramic layers that are stacked to form a base body, electrode layers among the ceramic layers to form at least one capacitor, at least one phase gate on a ceramic layer that corresponds to a surface of the base body, contact surfaces on a top surface of the base body, and through contacts that electrically connect the electrode layers to the contact surfaces. The through contacts are inside the base body at least in part. Side surfaces of the base body are substantially free of surface metallic contacts and of metal plating.
摘要翻译： 电气部件包括层叠以形成基体的陶瓷层，陶瓷层中的电极层以形成至少一个电容器，陶瓷层上的至少一个对应于基体的表面的相位栅极， 基体的顶表面，以及通过将电极层电连接到接触表面的触点。 贯穿触点至少部分在基体内。 基体的侧表面基本上没有表面金属触点和金属电镀。
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公开(公告)号：US20070271782A1
公开(公告)日：2007-11-29
申请号：US11630524
申请日：2005-06-30
IPC分类号： H01R9/00
CPC分类号： H01G4/232 , H01C1/14 , H01C1/144 , H01C7/18 , H01G4/228 , H01L23/49816 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K1/113 , H05K2201/09827 , H05K2201/09845 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： An electrical multilayer component includes a base body having stacked ceramic dielectric and metallization layers that are formed into component structures among the dielectric layers. Solder contacts are on the underside of the base body. Plated through-holes connect the component structures to the solder contacts. The plated through-holes have at least cross section that widens upward away from the solder contact.
摘要翻译： 电气多层组件包括具有堆叠的陶瓷电介质和金属化层的基体，其形成在电介质层中的组成结构中。 焊接触点位于基体的下侧。 电镀通孔将组件结构连接到焊接触点。 电镀通孔具有至少横截面，其从焊料接触部向上加宽。
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公开(公告)号：US20060170010A1
公开(公告)日：2006-08-03
申请号：US11220352
申请日：2005-08-31
IPC分类号： H01L29/768
CPC分类号： H03H7/0107 , H01C7/1006 , H01C7/18 , H01G4/232 , H01G4/30 , H01G4/40
摘要： Electrical component and switching mechanism with the component The invention relates to an electrical component with a sequence of ceramic layers (1, 11, 12) stacked one on top of the other that form a base body with electrode layers (21, 22, 23, 24, 25) arranged between the ceramic layers (1, 11, 12) that form at least one capacitor (32, 33, 34, 35), along with at least one phase gate (41, 42, 43, 44) that is applied to the surface of the base body of its ceramic layer (1, 11, 12), and in which the electrode layers (21, 22, 23, 24, 25) are connected in a electrically conductive manner to contact surfaces (61, 62, 63, 64, 65) by means of through contacts (71, 72, 73, 74, 75) running inside the base body. At the same time, the side surfaces of the base body are free of metal plating. In addition, the invention relates to a switching mechanism with the component. The invention has the advantage that very space-efficient filters can be produced in the “flip chip” style.
摘要翻译： 具有部件的电气部件和切换机构本发明涉及一种电气部件，其具有层叠在另一个之上的一系列陶瓷层（1,11,12），该陶瓷层形成具有电极层的基体（21,22,23， 布置在形成至少一个电容器（32,33,34,35）的陶瓷层（1,11,12）之间，以及至少一个相位栅极（41,42,43,44），其中所述至少一个相位栅极 施加到其陶瓷层（1,11,12）的基体的表面，并且其中电极层（21,22,23,24,25）以导电方式连接到接触表面（61,111） 62,63,64,65）通过在基体内运行的贯通触头（71,72,73,74,75）。 同时，基体的侧面没有金属电镀。 另外，本发明涉及具有该部件的切换机构。 本发明的优点是可以以“倒装芯片”的方式制造出非常节省空间的滤光片。
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