公开(公告)号：US20050064634A1

公开(公告)日：2005-03-24

申请号：US10671123

申请日：2003-09-24

申请人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Liu ,  Yayi Wei

发明人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Liu ,  Yayi Wei

IPC分类号： G06F17/50 ,  H01L21/027 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/762 ,  H01L21/82 ,  H01L21/338 ,  H01L21/331 ,  H01L21/8222

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.

摘要翻译： 正在处理的衬底上的材料层，例如， 以形成芯片，包括一个或多个功能结构。 为了在制造芯片期间控制图案密度，将不同尺寸和形状的虚拟填充结构添加到与材料层的功能结构不同距离的芯片。 特别地，虚拟结构的布置，尺寸和形状被确定为材料层的功能结构的距离和密度的函数。

公开(公告)号：US20060216905A1

公开(公告)日：2006-09-28

申请号：US11441649

申请日：2006-05-26

申请人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Liu ,  Yayi Wei

发明人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Liu ,  Yayi Wei

IPC分类号： H01L21/4763 ,  H01L21/76 ,  H01L21/461

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.

公开(公告)号：US20110133304A1

公开(公告)日：2011-06-09

申请号：US12980268

申请日：2010-12-28

申请人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

发明人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

IPC分类号： H01L29/00 ,  H01L21/66

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the functional areas. Each dummy structure has a size that is a function of the size and density of the functional areas.

摘要翻译： 芯片包括多个层中的多个功能区域和该层内的多个虚设结构。 虚拟结构与功能区域间隔开。 每个虚拟结构具有作为功能区域的大小和密度的函数的大小。

公开(公告)号：US07868427B2

公开(公告)日：2011-01-11

申请号：US12353193

申请日：2009-01-13

申请人： Sebastian Schmidt ,  Hang-Yip Liu ,  Thomas Schafbauer ,  Yayi Wei

发明人： Sebastian Schmidt ,  Hang-Yip Liu ,  Thomas Schafbauer ,  Yayi Wei

IPC分类号： H01L21/76 ,  H01L21/4763 ,  H01L21/302 ,  H01L23/544

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.

摘要翻译： 正在处理的衬底上的材料层，例如， 以形成芯片，包括一个或多个功能结构。 为了在制造芯片期间控制图案密度，将不同尺寸和形状的虚拟填充结构添加到与材料层的功能结构不同距离的芯片。 特别地，虚拟结构的布置，尺寸和形状被确定为材料层的功能结构的距离和密度的函数。

公开(公告)号：US20090124027A1

公开(公告)日：2009-05-14

申请号：US12353193

申请日：2009-01-13

申请人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

发明人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

IPC分类号： H01L21/66

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.

摘要翻译： 正在处理的衬底上的材料层，例如， 以形成芯片，包括一个或多个功能结构。 为了在制造芯片期间控制图案密度，将不同尺寸和形状的虚拟填充结构添加到与材料层的功能结构不同距离的芯片。 特别地，虚拟结构的布置，尺寸和形状被确定为材料层的功能结构的距离和密度的函数。

公开(公告)号：US07494930B2

公开(公告)日：2009-02-24

申请号：US11441649

申请日：2006-05-26

申请人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

发明人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

IPC分类号： H01L21/302

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.

摘要翻译： 正在处理的衬底上的材料层，例如， 以形成芯片，包括一个或多个功能结构。 为了在制造芯片期间控制图案密度，将不同尺寸和形状的虚拟填充结构添加到与材料层的功能结构不同距离的芯片。 特别地，虚拟结构的布置，尺寸和形状被确定为材料层的功能结构的距离和密度的函数。

公开(公告)号：US07071074B2

公开(公告)日：2006-07-04

申请号：US10671123

申请日：2003-09-24

申请人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

发明人： Sebastian Schmidt ,  Thomas Schafbauer ,  Hang Yip Liu ,  Yayi Wei

IPC分类号： H01L21/76 ,  H01L21/4763 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L22/10 ,  B81C1/00539 ,  G06F17/5068 ,  H01L21/027 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76229 ,  H01L21/82

摘要： A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.

公开(公告)号：US20060093971A1

公开(公告)日：2006-05-04

申请号：US11303301

申请日：2005-12-16

申请人： Hang Liu ,  Sebastian Schmidt ,  Benjamin Lin

发明人： Hang Liu ,  Sebastian Schmidt ,  Benjamin Lin

IPC分类号： G03F7/00

CPC分类号： G03F1/36 ,  G03F1/50 ,  G03F7/70283

摘要： An apparatus, system and method to compensate for the proximity effects in the imaging of patterns in a photolithography process. A light exposure of a photoresist layer is effectuated in predetermined patterns through an exposure mask having light-transmissive openings in correspondence to the predetermined patterns. The exposure mask has areas densely populated with the light-transmissive openings and areas sparsely populated with the light-transmissive openings. Light is attenuated through the densely populated light-transmissive openings by a different amount than through the sparsely populated light-transmissive openings.

公开(公告)号：US20170103523A1

公开(公告)日：2017-04-13

申请号：US15285626

申请日：2016-10-05

申请人： David Grodzki ,  Arne Hengerer ,  Michael Kaus ,  Elena Nioutsikou ,  Sebastian Schmidt

发明人： David Grodzki ,  Arne Hengerer ,  Michael Kaus ,  Elena Nioutsikou ,  Sebastian Schmidt

IPC分类号： G06T7/00 ,  G06T11/00

CPC分类号： G06T7/0012 ,  G06T11/006 ,  G06T11/008 ,  G06T2207/10081 ,  G06T2207/10088

摘要： The embodiments relate to a reconstructing an image of an examination object, a medical imaging apparatus, and a computer program product where a first image data record is acquired with a first imaging modality and at least one further image data record of at least one further imaging modality is provided. At least one first image is reconstructed on the basis of the first image data record using the at least one further image data record.

公开(公告)号：US09162253B2

公开(公告)日：2015-10-20

申请号：US13640164

申请日：2011-06-08

申请人： Thomas Tschurl ,  Dominic Gueldner ,  Sebastian Schmidt

发明人： Thomas Tschurl ,  Dominic Gueldner ,  Sebastian Schmidt

IPC分类号： B05D3/04 ,  B05D1/30 ,  B05D7/02 ,  B05D7/00

CPC分类号： B05D3/0406 ,  B05D1/30 ,  B05D3/0413 ,  B05D3/042 ,  B05D7/02 ,  B05D7/54

摘要： Method for flow coating a polymeric material, wherein at least a. one component (1) is inserted at an angle of 25° to 90° relative to the floor (5) into a holder (2), b. the component (1) is coated from an upper edge (1a) with a varnish (3) and the varnish (3) is, in the meantime or thereafter, impinged on within a region of 30% of the surface of the component (1) adjacent the upper edge (1a) by a stream of air (4).

摘要翻译： 流动涂覆聚合物材料的方法，其中至少一种。 一个部件（1）相对于地板（5）以25°至90°的角度插入到支架（2）中，b。 组分（1）由具有清漆（3）的上边缘（1a）涂覆，并且清漆（3）同时或此后撞击在组分（1）的表面的30％的区域内 ）通过空气流（4）邻近上边缘（1a）。