公开(公告)号：US06175150B1

公开(公告)日：2001-01-16

申请号：US09061904

申请日：1998-04-17

申请人： Seiji Ichikawa ,  Takeshi Umemoto ,  Toshiaki Nishibe ,  Kazunari Sato ,  Kunihiko Tubota ,  Masato Suga ,  Yoshikazu Nishimura ,  Keita Okahira ,  Tatsuya Miya ,  Tooru Kitakoga ,  Kazuhiro Tahara

发明人： Seiji Ichikawa ,  Takeshi Umemoto ,  Toshiaki Nishibe ,  Kazunari Sato ,  Kunihiko Tubota ,  Masato Suga ,  Yoshikazu Nishimura ,  Keita Okahira ,  Tatsuya Miya ,  Tooru Kitakoga ,  Kazuhiro Tahara

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49568 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A plastic-encapsulated semiconductor device is provided, which is capable of efficient heat dissipation without upsizing while preventing the moisture from reaching an IC chip. This device is comprised of an electrically-conductive island having a chip-mounting area, an IC chip fixed on the chip-mounting area of the island, leads electrically connected to bonding pads of the chip through bonding wires, a plastic package for encapsulating the island, the chip, the bonding wires, and inner parts of the leads. The package has an approximately flat bottom face. Outer parts of the leads are protruded from the package and are located in approximately a same plane as the bottom face of the package. The island has an exposition part exposed from the package at a location excluding the chip-mounting area. A lower face of the exposition part of the island is located in approximately a same plane as the bottom face of the package. The chip and the chip-mounting area of the island are entirely buried in the package. Apart of the island excluding the chip-mounting area is bent toward the bottom face of the package to be exposed therefrom.

摘要翻译： 提供了一种塑料封装的半导体器件，其能够在不加大尺寸的同时有效地散热，同时防止水分到达IC芯片。 该器件由具有芯片安装区域的导电岛，固定在岛的芯片安装区域上的IC芯片通过接合线电连接到芯片的焊盘，塑料封装件用于封装 岛，芯片，接合线和引线的内部部分。 该包装具有大致平坦的底面。 引线的外部部分从封装突出并且位于与封装的底面大致相同的平面中。 该岛具有在除了芯片安装区域之外的位置处从封装暴露的外露部分。 岛的展示部分的下表面位于与包装的底面大致相同的平面中。 岛的芯片和芯片安装区域完全埋在封装中。 除芯片安装区域之外的岛除了朝向包装的底面弯曲以暴露于其外。