公开(公告)号：US20160190352A1

公开(公告)日：2016-06-30

申请号：US15059674

申请日：2016-03-03

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji TSUKAGOSHI

IPC: H01L31/0203 ,  H01L23/31 ,  H01L23/498 ,  H01L31/0216

CPC classification number: H01L31/0203 ,  H01L23/3157 ,  H01L23/49838 ,  H01L31/02002 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

Abstract translation: 用于光学传感器装置的封装具有其中第一树脂模制部分和第二树脂模塑部分被整合的双重模制结构。 第一树脂模制部分具有其中安装有光学传感器元件的芯片焊盘部分的外围和引线的一部分用树脂模制成一体的结构。 第二树脂模制部分具有第一树脂模塑部分的周边用树脂模制以形成包装的外形的结构。 将具有过滤功能的玻璃基板接合到树脂模制部分的上表面，以形成安装光学传感器元件的空腔。

公开(公告)号：US20130134300A1

公开(公告)日：2013-05-30

申请号：US13669858

申请日：2012-11-06

Applicant: Seiko Instruments Inc.

Inventor： Hitoshi KAMAMORI ,  Sadao OKU ,  Hiroyuki FUJITA ,  Koji TSUKAGOSHI ,  Keiichiro HAYASHI

IPC: G01J1/42

CPC classification number: G01J1/42 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/1039 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (2), a glass substrate (9) with a cavity having divided and exposed through-hole electrodes (5) on the periphery thereof, and an optical sensor element (3) mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Abstract translation: 提供了高可靠性，紧凑型和低成本的光学传感器装置。 光学传感器装置包括玻璃盖基板（2），具有在其周边上具有分开和暴露的通孔电极（5）的空腔的玻璃基板（9）和安装在玻璃上的光学传感器元件（3） 盖基板，并且具有玻璃盖基板和具有空腔的玻璃基板结合在一起的结构。 通过与玻璃基板气密密封，确保高可靠性。 通过使用分割的通孔电极，封装尺寸减小，并且在制造中可以批量生产的装置的数量增加，这降低了成本。

公开(公告)号：US20130126702A1

公开(公告)日：2013-05-23

申请号：US13676404

申请日：2012-11-14

Applicant: Seiko Instruments Inc.

Inventor： Koji TSUKAGOSHI ,  Hitoshi KAMAMORI ,  Sadao OKU ,  Hiroyuki FUJITA ,  Keiichiro HAYASHI

IPC: G01J1/44

CPC classification number: G01J1/44 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/42

Abstract: An optical sensor element is mounted in a package which includes a glass lid substrate (1) having a filter function and a class substrate having a cavity. The glass substrate (2) having a cavity includes therein a through-electrode (5) in which metal is filled, and has wiring patterns (6, 7) provided by metalization on a front surface and a rear surface, respectively, thereof. The wiring pattern (6) and a wiring pattern (4; provided by retail nation on the glass lid substrate (1) are fixed and connected to each other with an adhesive having conductive particles (8) added thereto. The wiring patterns (6, 7) provided by metalization on the front surface and the rear surface, respectively, of the substrate (2) having a cavity and the metal filled in the through-electrode are structurally and electrically integrated wish each other.

Abstract translation: 光学传感器元件安装在包括具有过滤功能的玻璃盖基板（1）和具有空腔的类基板的封装中。 具有空腔的玻璃基板（2）在其中包括填充有金属的通孔（5），并且在其前表面和后表面上分别具有通过金属化提供的布线图案（6,7）。 布置图案（6）和由玻璃盖基板（1）上的零售商提供的布线图案（4）通过添加有导电粒子（8）的粘合剂彼此固定并相互连接， 7）通过金属化分别在具有空腔的衬底（2）和填充在通孔中的金属的表面和后表面上分别结构和电气集成在一起。

公开(公告)号：US20150076715A1

公开(公告)日：2015-03-19

申请号：US14485918

申请日：2014-09-15

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji TSUKAGOSHI

IPC: H01L23/498

CPC classification number: H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/29139 ,  H01L2924/00014 ,  H01L2224/8384

Abstract: Provided is a downsized semiconductor device having high reliability. A plurality of recessed portions (2) each having an inverted pyramid shape are formed in a semiconductor chip placing region (3) provided on a surface of an island portion (1) on which a semiconductor chip is to be mounted. The recessed portions (2) are arranged so that at least one side of the recessed portion (2) having an inverted pyramid shape faces in parallel to the periphery of the rectangular semiconductor chip placing region (3), which is closest thereto, and the corner of the recessed portion (2) opposite to the side faces the inner side of the semiconductor chip placing region (3).

Abstract translation: 提供了一种具有高可靠性的小尺寸半导体器件。 在设置有要安装半导体芯片的岛部（1）的表面上的半导体芯片放置区域（3）中形成有多个具有倒棱锥形状的凹部（2）。 凹部（2）被布置成使得具有倒棱锥形状的凹部（2）的至少一侧与最靠近的矩形半导体芯片放置区域（3）的周边平行， 凹部（2）的与侧面相对的角部位于半导体芯片配置区域（3）的内侧。

公开(公告)号：US20150076645A1

公开(公告)日：2015-03-19

申请号：US14485901

申请日：2014-09-15

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Hiroyuki FUJITA ,  Sadao OKU ,  Koji TSUKAGOSHI ,  Keiichiro HAYASHI

IPC: H01L31/0203 ,  H01L31/02

CPC classification number: H01L31/0203 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.

Abstract translation: 掺有具有红外阻挡滤光器特性的铜离子的磷酸盐基玻璃形成颗粒，并与透明封装树脂混合以封装半导体元件。 玻璃粒子的粒径为被阻挡的红外线的波长的四倍以上。 即使入射光角度变化并且耐潮湿，也可以获得具有稳定的滤光器特性的光学半导体器件。

公开(公告)号：US20150221783A1

公开(公告)日：2015-08-06

申请号：US14603500

申请日：2015-01-23

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji TSUKAGOSHI

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L23/3157 ,  H01L23/49838 ,  H01L31/02002 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A package for an optical sensor device has a double molding structure in which a first resin molded portion (1) and a second resin molded portion (2) are subjected to contact fitting. The first resin molded portion (1) has a structure in which peripheries of a die pad portion (8) on which an optical sensor element (5) is mounted and a part of leads (3a, 3b) are molded with a resin so as to be integrated. The second resin molded portion (2) has a structure in which the periphery of the first resin molded portion (1) is molded with a resin so as to form an outer shape. When a cavity is formed, a glass substrate (4) having a filter function and an upper surface of the resin molded portions are bonded to each other to form a cavity structure.

Abstract translation: 用于光学传感器装置的封装具有双重模制结构，其中第一树脂模制部分（1）和第二树脂模塑部分（2）经受接合配合。 第一树脂模制部分（1）具有其中安装有光学传感器元件（5）的芯片焊盘部分（8）的周边和一部分引线（3a，3b）被树脂模塑成的结构，以便 被整合。 第二树脂模制部分（2）具有其中第一树脂模塑部分（1）的周边用树脂模制以形成外形的结构。 当形成空腔时，具有过滤功能的玻璃基板（4）和树脂模制部分的上表面彼此结合以形成空腔结构。

公开(公告)号：US20150008568A1

公开(公告)日：2015-01-08

申请号：US14319414

申请日：2014-06-30

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji TSUKAGOSHI ,  Sadao OKU ,  Hiroyuki FUJITA ,  Keiichiro HAYASHI ,  Masaru AKINO

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/3114 ,  H01L23/24 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00012

Abstract: Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted, a surrounding portion (1b) that surrounds the hollow portion (10), and a bottom surface portion (1a); an inner lead (2e, 2f); and an outer lead (2a, 2b) exposed from the resin molded member (1). The inner lead buried in the molded member (1) includes an L-shaped lead extending portion having a through hole formed therethrough.

Abstract translation: 提供一种包括具有中空部分的封装的半导体器件，其可以满足尺寸和厚度的减小的需要。 半导体装置包括：具有中空部（10）的树脂成形体（1），具有安装有半导体芯片（6）的内底面，围绕中空部（10）的环绕部（1b） 和底面部分（1a）; 内引线（2e，2f）; 和从树脂成形体（1）露出的外引线（2a，2b）。 埋在模制构件（1）中的内部引线包括具有穿过其形成的通孔的L形引线延伸部分。