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公开(公告)号：US08641232B2
公开(公告)日：2014-02-04
申请号：US13162668
申请日：2011-06-17
申请人： Seiko Kawashima , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
发明人： Seiko Kawashima , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
IPC分类号： F21V21/00
CPC分类号： F21V19/0055 , F21K9/232 , F21V3/00 , F21V29/773 , F21V29/89 , F21Y2115/10 , H01L2224/48137
摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.
摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。
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公开(公告)号：US20110310609A1
公开(公告)日：2011-12-22
申请号：US13162668
申请日：2011-06-17
申请人： Seiko KAWASHIMA , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
发明人： Seiko KAWASHIMA , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
IPC分类号： F21V21/00
CPC分类号： F21V19/0055 , F21K9/232 , F21V3/00 , F21V29/773 , F21V29/89 , F21Y2115/10 , H01L2224/48137
摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.
摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。
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公开(公告)号：US08569786B2
公开(公告)日：2013-10-29
申请号：US13105868
申请日：2011-05-11
申请人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
发明人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
IPC分类号： H01L33/62
CPC分类号： F21S8/086 , F21K9/23 , F21V23/06 , F21W2131/103 , F21Y2115/10 , H01R12/515
摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.
摘要翻译： 根据一个实施例，发光器件包括衬底，发光元件和连接器。 基板具有表面和背面，并且在表面上形成电源端子。 发光元件安装在基板的表面上。 连接器包括与基板的表面侧上的电源端子接触的接触部分和具有在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到电线 连接器端子的连接部分。
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公开(公告)号：US20110278632A1
公开(公告)日：2011-11-17
申请号：US13105868
申请日：2011-05-11
申请人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
发明人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
IPC分类号： H01L33/62
CPC分类号： F21S8/086 , F21K9/23 , F21V23/06 , F21W2131/103 , F21Y2115/10 , H01R12/515
摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with, the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.
摘要翻译： 根据一个实施例，发光器件包括衬底，发光元件和连接器。 基板具有表面和背面，并且在表面上形成电源端子。 发光元件安装在基板的表面上。 连接器包括与基板表面侧的电源端子接触的接触部分和在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到 连接器端子的导线连接部分。
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公开(公告)号：US08408724B2
公开(公告)日：2013-04-02
申请号：US12641841
申请日：2009-12-18
申请人： Kozo Ogawa , Yusuke Shibahara , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Haruki Takei
发明人： Kozo Ogawa , Yusuke Shibahara , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Haruki Takei
IPC分类号： F21V8/00
CPC分类号： F21S8/02 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.
摘要翻译： 光源模块包括模块衬底，金属导体，多个半导体发光元件，白色漫反射层和半透明密封构件。 金属导体以预定图案设置在模块基板的前表面上。 半导体发光元件电连接到金属导体并安装在模块基板的前表面上。 白色漫反射层包括半导体发光元件所在的多个孔，比半导体发光元件薄，并且层叠在模块基板的前表面。 半透明密封件将半导体发光元件埋入漫射反射层下方，并与荧光体混合。
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公开(公告)号：US20100165624A1
公开(公告)日：2010-07-01
申请号：US12641841
申请日：2009-12-18
申请人： Kozo Ogawa , Yusuke Shibahara , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Haruki Takei
发明人： Kozo Ogawa , Yusuke Shibahara , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Haruki Takei
IPC分类号： F21V1/00
CPC分类号： F21S8/02 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.
摘要翻译： 光源模块包括模块衬底，金属导体，多个半导体发光元件，白色漫反射层和半透明密封构件。 金属导体以预定图案设置在模块基板的前表面上。 半导体发光元件电连接到金属导体并安装在模块基板的前表面上。 白色漫反射层包括半导体发光元件所在的多个孔，比半导体发光元件薄，并且层叠在模块基板的前表面。 半透明密封件将半导体发光元件埋入漫射反射层下方，并与荧光体混合。
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公开(公告)号：US08197099B2
公开(公告)日：2012-06-12
申请号：US12625917
申请日：2009-11-25
申请人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
发明人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
IPC分类号： F21V29/00
CPC分类号： H01L23/4006 , H01L23/3736 , H01L2924/0002 , H01L2924/09701 , H05K1/0203 , H05K1/0306 , H05K1/092 , H05K3/0061 , H05K3/102 , H05K7/20481 , H05K2201/10409 , H01L2924/00
摘要： The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.
摘要翻译： 本发明提供一种电子部件安装模块，其能够增加板和散热构件之间的粘附性，改善导热性，并且有效地辐射由作为电子部件的LED产生的热量。 LED安装在陶瓷板的表面上，并且板的后表面1b侧设置在散热构件上。 制成具有高导热性和柔性的金属微粒层，以在基板和散热构件之间插入。
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公开(公告)号：US08716943B2
公开(公告)日：2014-05-06
申请号：US13027788
申请日：2011-02-15
申请人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Akiko Saito
发明人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Akiko Saito
CPC分类号： H05B33/0884 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , H05B33/0803 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.
摘要翻译： 根据一个实施例，一种发光装置包括：基板，包括绝缘表面;多个发光元件，安装在基板的表面上并彼此电连接，正电力馈送导体和负电力供电导体 安装在基板的表面上，以将功率馈送到发光元件，从馈电导体引出的引出端到发光元件的安装区域的外部，以及连接到 引出端子并布置在安装区域外部。
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公开(公告)号：US20120026738A1
公开(公告)日：2012-02-02
申请号：US13193032
申请日：2011-07-28
申请人： Tsuyoshi Oyaizu , Haruki Takei , Seiko Kawashima
发明人： Tsuyoshi Oyaizu , Haruki Takei , Seiko Kawashima
IPC分类号： F21V21/00
CPC分类号： F21V19/004 , F21K9/00 , F21S8/086 , F21V29/70 , F21W2131/103 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48137 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a light-emitting apparatus includes a substrate, an attachment member, and a mechanical fixing component. The substrate has light-emitting elements mounted on one surface side thereof. The attachment member includes a concave portion in which the substrate is arranged with a gap between the substrate and a side circumference of the concave portion. The mechanical fixing component includes a pressure portion that is in contact with the one surface side of the substrate, the mechanical fixing component being configured to hold the substrate in the concave portion of the attachment member by elastic pressing force of the pressure portion acting in a direction from the one surface side toward the other surface side of the substrate.
摘要翻译： 根据一个实施例，发光装置包括基板，附接构件和机械固定部件。 基板具有安装在其一个表面侧上的发光元件。 所述安装部件包括凹部，所述基板在所述基板与所述凹部的侧周之间具有间隙。 所述机械固定部件包括与所述基板的一个表面侧接触的压力部，所述机械固定部件构造成通过所述压力部的作用力的弹性压力将所述基板保持在所述安装部件的凹部内 方向从基板的一个表面侧朝向另一个表面侧。
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公开(公告)号：US08044570B2
公开(公告)日：2011-10-25
申请号：US12581911
申请日：2009-10-20
申请人： Tsuyoshi Oyaizu , Kozo Ogawa , Seiko Kawashima , Akiko Takahashi , Haruki Takei , Erika Takenaka
发明人： Tsuyoshi Oyaizu , Kozo Ogawa , Seiko Kawashima , Akiko Takahashi , Haruki Takei , Erika Takenaka
CPC分类号： F21V31/04 , F21V9/30 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： A lighting device includes a printed wiring board, a plurality of light-emitting elements, a sealing member, and a color conversion unit, and an adhesive layer. The sealing member has light transmitting properties and seals the light-emitting elements mounted on the printed wiring board. The color conversion unit includes a cover member of light transmitting properties, and a fluorescent substance layer provided on the inner surface of the cover member. The adhesive layer has light-transmitting properties, and adheres the sealing member to the fluorescent substance layer of the color conversion unit in an airtight manner.
摘要翻译： 照明装置包括印刷线路板，多个发光元件，密封构件和颜色转换单元以及粘合剂层。 密封构件具有透光性，并且密封安装在印刷线路板上的发光元件。 颜色转换单元包括透光性的盖构件和设置在盖构件的内表面上的荧光物质层。 粘合剂层具有透光性，并且密封构件以气密的方式粘附到颜色转换单元的荧光物质层。
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