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公开(公告)号：US11984388B2
公开(公告)日：2024-05-14
申请号：US18330133
申请日：2023-06-06
发明人： Stephen St. Germain , Jay A. Yoder , Dennis Lee Conner , Frank Robert Cervantes , Andrew Celaya
IPC分类号： H01L23/498 , H01L21/56 , H01L23/31 , H01L23/495
CPC分类号： H01L23/49805 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L23/49861 , H01L2924/0002 , H01L2924/181
摘要： Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
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公开(公告)号：US09034733B2
公开(公告)日：2015-05-19
申请号：US14159648
申请日：2014-01-21
CPC分类号： H01L21/02076 , H01L21/3043 , H01L21/3046 , H01L21/3065 , H01L21/67028 , H01L21/6836 , H01L21/78 , H01L21/7813 , H01L23/544 , H01L2221/68327 , H01L2223/5446
摘要： In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and separating portions of the backmetal layer within the singulation lines using a pressurized fluid applied to the carrier tape.
摘要翻译： 在一个实施例中，通过将半导体晶片放置在载体带上，背衬层与载带相邻，将半导体晶片从具有背金属层的半导体晶片分离，通过半导体晶片形成分割线，以暴露分离线内的后金属层 并且使用施加到载带上的加压流体将分离线内的后金属层的部分分离。
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公开(公告)号：US11710686B2
公开(公告)日：2023-07-25
申请号：US17457148
申请日：2021-12-01
发明人： Stephen St. Germain , Jay A. Yoder , Dennis Lee Conner , Frank Robert Cervantes , Andrew Celaya
IPC分类号： H01L23/498 , H01L21/56 , H01L23/495 , H01L23/31
CPC分类号： H01L23/49805 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L23/49861 , H01L2924/0002 , H01L2924/181
摘要： Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
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公开(公告)号：US11217515B2
公开(公告)日：2022-01-04
申请号：US16554980
申请日：2019-08-29
发明人： Stephen St. Germain , Jay A. Yoder , Dennis Lee Conner , Frank Robert Cervantes , Andrew Celaya
IPC分类号： H01L23/498 , H01L21/56 , H01L23/495 , H01L23/31
摘要： Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
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公开(公告)号：US09847219B2
公开(公告)日：2017-12-19
申请号：US15267488
申请日：2016-09-16
IPC分类号： H01L21/78 , H01L21/304 , H01L21/02 , H01L21/67 , H01L21/3065 , H01L21/683 , H01L23/544
CPC分类号： H01L21/02076 , H01L21/3043 , H01L21/3046 , H01L21/3065 , H01L21/67028 , H01L21/6836 , H01L21/78 , H01L21/7813 , H01L23/544 , H01L2221/68327 , H01L2223/5446
摘要： In one embodiment, semiconductor die are singulated from a semiconductor wafer having a layer of material by placing the semiconductor wafer onto a carrier tape with the layer of material adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the layer of material within the singulation lines, and separating portions of the layer of material using a fluid.
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公开(公告)号：US20180096925A1
公开(公告)日：2018-04-05
申请号：US15833533
申请日：2017-12-06
IPC分类号： H01L23/498 , H01L21/56 , H01L23/495 , H01L23/31
摘要： Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on an opposing side of the die from the first face of the die. The at least one clip may include at least one lead in electrical communication with the at least one electrical contact on the second face of the die. A mold compound or an encapsulating compound may be included around the die and a majority of the at least one clip where a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not overmolded or encapsulated. The semiconductor package includes no lead frame.
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公开(公告)号：US09911684B1
公开(公告)日：2018-03-06
申请号：US15240423
申请日：2016-08-18
IPC分类号： H01L23/495 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49541 , H01L21/4828 , H01L21/4842 , H01L23/49503 , H01L23/49513 , H01L23/49548 , H01L23/49575 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/84 , H01L2224/29191 , H01L2224/32245 , H01L2224/40245 , H01L2224/73263 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2224/92246 , H01L2924/0665 , H01L2924/07025 , H01L2924/0715
摘要： A system, in some embodiments, comprises: a first surface of a lead frame; a second surface of the lead frame, opposite the first surface, said second surface having been etched; and one or more holes passing through said lead frame and coincident with the first and second surfaces, wherein said one or more holes are adapted to control fluid flow on said first surface.
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公开(公告)号：US20140134828A1
公开(公告)日：2014-05-15
申请号：US14159648
申请日：2014-01-21
IPC分类号： H01L21/78
CPC分类号： H01L21/02076 , H01L21/3043 , H01L21/3046 , H01L21/3065 , H01L21/67028 , H01L21/6836 , H01L21/78 , H01L21/7813 , H01L23/544 , H01L2221/68327 , H01L2223/5446
摘要： In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and separating portions of the backmetal layer within the singulation lines using a pressurized fluid applied to the carrier tape.
摘要翻译： 在一个实施例中，通过将半导体晶片放置在载体带上，背衬层与载带相邻，将半导体晶片从具有背金属层的半导体晶片分离，通过半导体晶片形成分割线，以暴露分离线内的后金属层 并且使用施加到载带上的加压流体将分离线内的后金属层的部分分离。
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公开(公告)号：US10522448B2
公开(公告)日：2019-12-31
申请号：US15833533
申请日：2017-12-06
IPC分类号： H01L23/498 , H01L21/56 , H01L23/495 , H01L23/31
摘要： Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on an opposing side of the die from the first face of the die. The at least one clip may include at least one lead in electrical communication with the at least one electrical contact on the second face of the die. A mold compound or an encapsulating compound may be included around the die and a majority of the at least one clip where a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not overmolded or encapsulated. The semiconductor package includes no lead frame.
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公开(公告)号：US09558968B2
公开(公告)日：2017-01-31
申请号：US14484141
申请日：2014-09-11
IPC分类号： H01L21/56 , H01L23/31 , H01L23/495
CPC分类号： H01L23/49805 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L23/49861 , H01L2924/0002 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： A method of forming a semiconductor device package. Implementations may include providing an adhesive tape; contacting at least one electrical contact of at least one die with an adhesive surface of the adhesive tape; mechanically and electrically coupling at least one clip with the at least one die and contacting an electrical contact of the at least one clip with the adhesive surface; one of overmolding and encapsulating the at least one die and a majority of the at least one clip with one of a mold compound and an encapsulating compound, respectively, wherein the at least one electrical contact of the at least one die and the electrical contact of the at least one clip are not one of overmolded and encapsulated, forming the semiconductor device package; removing the semiconductor device package from the adhesive surface; and including no leadframe in the package.
摘要翻译： 一种形成半导体器件封装的方法。 实施方案可以包括提供胶带; 使至少一个模具的至少一个电触头与所述胶带的粘合表面接触; 将至少一个夹子与所述至少一个模具机械和电耦合并且使所述至少一个夹子的电接触与所述粘合剂表面接触; 分别将模具化合物和封装化合物之一分别包覆成型并包封至少一个模头和至少一个夹子的大部分，其中至少一个模具和电触头的至少一个电触点 所述至少一个夹子不是包覆成型和封装的夹子，形成所述半导体器件封装; 从粘合剂表面去除半导体器件封装; 并且在包装中不包括引线框架。
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