Abstract:
An automated workpiece processing system has a transfer robot including an end effector having arms which move linearly towards each other to pick up a workpiece. Each arm has two workpiece contactors for engaging the edges of the workpiece. The contactors are positioned equally distant from the workpiece edges. The arms are moved linearly together, while they remain parallel to each other. The contactors contact the edges of the workpiece without causing sliding or displacement of the workpiece. Transfer robot movement or pre-positioning of the end effector is minimized, expediting handling of workpieces within the automated system.
Abstract:
An automated processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress wafers. Immersion and spin process modules are located in the process bay. A process robot moves between the indexer bay and process bay to carry wafers to and from the process modules. The wafers are processed within a carrier, reducing the potential for physical damage to the wafers. The process robot hands the carrier off to a rotor, in the spin process modules, or to an immersion elevator in the immersion module. Both spin and immersion processing are performed within an automated system.
Abstract:
A centrifugal processor includes an elongated inlet and outlet in fluid communication with a rotor housing having an eccentric bowl. A rotor having fan blades and adapted to hold flat media is rotatably disposed within the rotor housing. An intake gate is pivotably mounted to the rotor housing to swing about the rotor into a closed position during a rinse mode and into an open position during a drying mode. The gate has a wedge that is designed to almost contact the rotor when the gate is in the open position for drying. The geometry of the elongated inlet, outlet, and eccentric bowl, in combination with the design of the rotor and that of the intake gate, work together to create a cross flow fan having a flow path across the flat media and one that exposes the flat media to large volumes of incoming air only once.
Abstract:
An automated processing system for processing flat workpieces, such as semiconductor wafers, operates by loading the workpieces into a first carrier. A process robot is adapted to engage external features of the first carrier, for lifting and moving the first carrier within the system. The process robot delivers the first carrier holding the wafers of a first size to a process chamber. The first carrier is secured in the process chamber by one or more of the external features of the first carrier. The first carrier has interior features, such as combs and slots, for holding wafers of a different first size. A second carrier has external features which are the same as the external features of the first carrier. The second carrier has inside features which are dimensioned to hold wafers of a second size, different from the first size. The automated processing system can accordingly handle or operate with both the first and second carriers, and thereby process workpieces having different sizes.
Abstract:
A workpiece handling and processing system has a interface section for loading wafers from cassettes into carriers. The wafers are lifted out of cassettes by a buffer elevator and moved into a position over an open carrier by a buffer robot. A comb elevator lifts combs entirely through the open cassette, to transfer the wafers from the buffer robot into the carrier. A process robot moves loaded carriers from the interface section to one or more process chambers in a process section. The advantages of processing wafers within a carrier are achieved within a compact space and with high throughput.
Abstract:
A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier . Wafer retainers on the carrier pivot to better secure wafers within the carrier.
Abstract:
A system and method for cleaning boxes used for handling flat media includes a rotor rotatably mounted within an enclosure, with spray nozzles in the enclosure for spraying fluid toward the rotor. The rotor has at least one box holder assembly for holding a box. At least one retainer bar is located on the rotor for engaging a front section of the box to retain the box in the box holder assembly during rotation of the rotor. The retainer bar is preferably moveable from a first position where the retainer bar restrains the box on the box holder assembly, to a second position where the retainer bar is moved away from the box. The box holder assembly may alternatively include a base with a plurality of grooved elements thereon that are adapted to engage a flange on the box for securing the box to the box holder assembly.
Abstract:
A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.