公开(公告)号：US20030062069A1

公开(公告)日：2003-04-03

申请号：US10224625

申请日：2002-08-20

Applicant: Semitool, Inc

Inventor： Ronald G. Breese ,  C. James Bryer ,  Eric J. Bergman ,  Dana R. Scranton

IPC: B08B007/00

CPC classification number: H01L21/67051 ,  B08B9/0861 ,  B08B9/32 ,  Y10S134/902

Abstract: In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.

Abstract translation: 在清洁金属离子污染物（特别是铜）的清洁方法中，容器被装载到清洁装置中。 用稀释的螯合剂溶液喷洒容器。 螯合剂溶液从容器中除去金属污染物。 然后用漂洗液如去离子水和表面活性剂漂洗容器。 然后将容器干燥，优选通过施加热和/或热空气运动。

公开(公告)号：US20030051743A1

公开(公告)日：2003-03-20

申请号：US10200071

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Ronald G. Breese ,  C. James Bryer ,  Eric J. Bergman ,  Dana R. Scranton

IPC: B08B007/00

CPC classification number: H01L21/67051 ,  B08B3/12 ,  B08B9/0861 ,  B08B9/32

Abstract: In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a loader of a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution, while the rotor is spinning. The chelating agent solution removes metallic contamination from the containers. The containers are then sprayed with a rinsing liquid, such as deionized water and a surfactant while the rotor is spinning and heat is applied. The containers are then dried by applying heat, hot air movement and spinning the rotor.

Abstract translation: 在清洁金属离子污染物尤其是铜的清洁方法中，将容器装载到清洁装置的装载机中。 当转子旋转时，用稀释的螯合剂溶液喷洒容器。 螯合剂溶液从容器中除去金属污染物。 然后在转子旋转并施加热量的同时，用诸如去离子水和表面活性剂的冲洗液体喷洒容器。 然后通过加热，热空气运动并旋转转子干燥容器。

公开(公告)号：US20040040583A1

公开(公告)日：2004-03-04

申请号：US10654849

申请日：2003-09-04

Applicant: Semitool, Inc.

Inventor： Ronald G. Breese ,  Dana R. Scranton ,  Eric J. Bergman ,  Michael E. Bartkoski ,  Cobby S. Grove

IPC: F23J001/00

CPC classification number: H01L21/02054 ,  B01D53/86 ,  B01D2257/106 ,  B08B3/02 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2230/01 ,  H01L21/02052 ,  H01L21/67017 ,  H01L21/6704

Abstract: A workpiece processing system for processing semiconductor wafers and other flat media includes a standalone processing unit having two or more modules vertically stacked on top of one another. A first module includes an ozone generator, a DI water supply, a purge gas/drying gas supply, and optionally includes an ammonium hydroxide generator. A second module is preferably stacked on top of the first module and includes a processing chamber in communication with the devices in the first module. The processing chamber preferably includes a rotor for holding and rotating workpieces, one or more spray manifolds, an ozone destructor, an anti-static generator, and/or any other suitable workpiece-processing devices. The rotor is preferably designed to hold two workpiece-carrying cassettes each capable of holding up to 25 workpieces. A third module is preferably stacked on top of the second module and includes the system electronics and controls.

Abstract translation: 用于处理半导体晶片和其它平面介质的工件处理系统包括具有彼此垂直堆叠的两个或更多个模块的独立处理单元。 第一模块包括臭氧发生器，去离子水供应源，净化气体/干燥气体源，并且任选地包括氢氧化铵发生器。 第二模块优选堆叠在第一模块的顶部上，并且包括与第一模块中的装置通信的处理室。 处理室优选地包括用于保持和旋转工件的转子，一个或多个喷雾歧管，臭氧破坏器，防静电发生器和/或任何其它合适的工件加工装置。 转子优选地设计成容纳两个能够容纳多达25个工件的工件运载盒。 第三模块优选地堆叠在第二模块的顶部并且包括系统电子装置和控制。